# US 9,752,562 B2 · Resistively heated shape memory polymer device > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,752,562 B2 - Document ID: US9752562B2 - Status: Granted - Kind: B2 - Application number: 15/299,213 - Filed: 2016-10-20 - Published: 2017-03-02 - Granted: 2017-09-05 - Earliest claimed: 2013-03-14 - Assignees: Lawrence Livermore National Security, LLC - Applicants: Lawrence Livermore National Security, LLC - Inventors: John E. Marion, III; Jane P. Bearinger; Thomas S. Wilson; Duncan J. Maitland - Web page: https://patentgrep.com/patent/US9752562B2 ## CPC - F03G 7/0612: {using polymers} - F03G 7/0614: {using shape memory elements} - B32B 2311/005: Shape memory alloys - Y10T 29/49002: Electrical device making - F03G: SPRING, WEIGHT, INERTIA OR LIKE MOTORS; MECHANICAL-POWER PRODUCING DEVICES OR MECHANISMS, NOT OTHERWISE PROVIDED FOR OR USING ENERGY SOURCES NOT OTHERWISE PROVIDED FOR (arrangements in connection with power supply in vehicles from force of nature B60K16/00; electric propulsion with power supply in vehicles from force of nature B60L8/00) - B32B: LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract A resistively heated shape memory polymer device is made by providing a rod, sheet or substrate that includes a resistive medium. The rod, sheet or substrate is coated with a first shape memory polymer providing a coated intermediate unit. The coated intermediate unit is in turn coated with a conductive material providing a second intermediate unit. The second coated intermediate unit is in turn coated with an outer shape memory polymer. The rod, sheet or substrate is exposed and an electrical lead is attached to the rod, sheet or substrate. The conductive material is exposed and an electrical lead is attached to the conductive material. ## Claims ### Claim 1 An apparatus comprising: a conductive substrate including a resistive medium; a first shape memory polymer (SMP) coating the conductive substrate; a first conductive material member coating the first SMP coated conductive substrate; a second SMP coating the first conductive material member coated first SMP coated conductive substrate; and first and second electrical leads; wherein a portion of the conductive substrate is exposed and a portion of the first conductive material member is exposed; wherein the first electrical lead is coupled to the exposed portion of the conductive substrate and the second electrical lead is coupled to the exposed portion of the first conductive material member; wherein (a) the first SMP directly contacts the first conductive material member; (b) the conductive substrate directly contacts the first SMP, and (c) the first conductive material member directly contacts the second SMP. ### Claim 2 (depends on 1) The apparatus of claim 1 wherein the resistive medium includes a solid conductive material. ### Claim 3 (depends on 1) The apparatus of claim 1 wherein the resistive medium includes a composite that contains conductive particles. ### Claim 4 (depends on 3) The apparatus of claim 3 wherein the conductive particles include carbon black. ### Claim 5 (depends on 3) The apparatus of claim 3 wherein the conductive particles include carbon nanotubes. ### Claim 6 (depends on 3) The apparatus of claim 3 wherein the conductive particles include metallic fillers. ### Claim 7 (depends on 1) The apparatus of claim 1 wherein the conductive substrate includes conductive particles. ### Claim 8 (depends on 1) The apparatus of claim 1 wherein the second SMP coated first conductive material member coated first SMP coated conductive substrate is shaped as a basket. ### Claim 9 (depends on 1) The apparatus of claim 1, wherein the conductive substrate includes a conductive sheet. ### Claim 10 (depends on 1) The apparatus of claim 1, wherein the first SMP has a primary shape and a secondary shape and the first SMP transitions from the secondary shape to the primary shape when the first SMP is heated above its glass transition temperature. ### Claim 11 An apparatus comprising: a conductive substrate including a resistive medium; a first shape memory polymer (SMP) coating the conductive substrate; a conductive material coating the first SMP coated conductive substrate; a second SMP coating the conductive material coated first SMP coated conductive substrate; and first and second electrical leads; wherein the second SMP coated conductive material coated first SMP coated conductive substrate is shaped as a basket; wherein a portion of the conductive substrate is exposed and a portion of the conductive material is exposed; wherein the first electrical lead is coupled to the exposed portion of the conductive substrate and the second electrical lead is coupled to the exposed portion of the conductive material. ### Claim 12 (depends on 11) The apparatus of claim 11 wherein the resistive medium is a solid conductive material. ### Claim 13 (depends on 11) The apparatus of claim 11 wherein the resistive medium is a composite that contains conductive particles. ### Claim 14 (depends on 13) The apparatus of claim 13 wherein the conductive particles include carbon black. ### Claim 15 (depends on 13) The apparatus of claim 13 wherein the conductive particles include carbon nanotubes. ### Claim 16 (depends on 13) The apparatus of claim 13 wherein the conductive particles include metallic fillers. ### Claim 17 (depends on 11) The apparatus of claim 11 wherein the conductive substrate includes conductive particles. ### Claim 18 (depends on 11) The apparatus of claim 11, wherein the conductive substrate includes a conductive sheet. ### Claim 19 (depends on 11) The apparatus of claim 11, wherein the conductive substrate directly contacts the first SMP and the conductive material directly contacts the second SMP. ### Claim 20 (depends on 11) The apparatus of claim 11, wherein the first SMP directly contacts the conductive material.