# US 9,752,247 B2 · Multi-layer encapsulated structures > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,752,247 B2 - Document ID: US9752247B2 - Status: Granted - Kind: B2 - Application number: 14/017,510 - Filed: 2013-09-04 - Published: 2014-01-02 - Granted: 2017-09-05 - Earliest claimed: 1997-04-04 - Assignees: University of Southern California - Applicants: University of Southern California - Inventors: Adam L. Cohen - Web page: https://patentgrep.com/patent/US9752247B2 ## CPC - C25D 5/022: {using masking means} - B33Y 10/00: Processes of additive manufacturing - B81C 1/00126: {Static structures not provided for in groups B81C1/00031 - B81C1/00119} - C25D 1/00: Electroforming - C25D 1/003: {3D structures, e.g. superposed patterned layers} - C25D 5/10: Electroplating with more than one layer of the same or of different metals (for bearings C25D7/10) - C25D 5/12: at least one layer being of nickel or chromium - C25D 5/22: Electroplating combined with mechanical treatment during the deposition - C25D 5/611: {Smooth layers} - C25D 17/06: Suspending or supporting devices for articles to be coated - H05K 3/241: {characterised by the electroplating method; means therefor, e.g. baths or apparatus} - H10P 14/47: Electrolytic deposition, i.e. electroplating; Electroless plating - B81C 2201/0181: Physical Vapour Deposition [PVD], i.e. evaporation, sputtering, ion plating or plasma assisted deposition, ion cluster beam technology - B81C 2201/0197: Processes for making multi-layered devices not provided for in groups B81C2201/0176 - B81C2201/0192 - B81C 2201/032: LIGA process - Y10T 428/12486: Laterally noncoextensive components [e.g., embedded, etc.] - Y10T 428/239: Complete cover or casing - C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR - B33Y: ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS - H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10 - Y10T: TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION ## Abstract An electroplating method that includes: a) contacting a first substrate with a first article, which includes a substrate and a conformable mask disposed in a pattern on the substrate; b) electroplating a first metal from a source of metal ions onto the first substrate in a first pattern, the first pattern corresponding to the complement of the conformable mask pattern; and c) removing the first article from the first substrate, is disclosed. Electroplating articles and electroplating apparatus are also disclosed. ## Claims ### Claim 1 A multi-layer device, comprising: a. at least one part comprising: i. at least one first layer comprising at least one first planarized material; ii. at least one second layer comprising at least one core material and at least one second material, whereby the at least one second material completely surrounds the sides of the at least one core material and wherein the at least one core material is completely bounded from below by the first planarized material; and iii. at least one third layer comprising at least one third planarized material wherein the third planarized material completely bounds the at least one core material of the at least one second layer from above; wherein the at least one core material is completely encapsulated by a combination of the at least one first planarized material, the at least one second material, and the at least one third planarized material; and wherein the device is selected from the group of devices consisting of: (1) a device with hollow internal features, (2) a device with cantilever features, (3) a device having a chandelier geometry, (4) a device including a plurality of parts that are connected to one another to form a functional assembly with each of the plurality of parts remaining stationary relative to the other parts, and (5) a device including a plurality of parts that are connected to one another to form a functional assembly with at least two of the parts being movable relative to one another wherein the at least one first planarized material, the at least one second material, and the at least one third planarized material comprise the same material. ### Claim 2 (depends on 1) The device of claim 1 wherein the same material comprises nickel and the at least one core material comprises copper. ### Claim 3 (depends on 1) The device of claim 1 wherein the at least one second layer is a single layer. ### Claim 4 (depends on 1) The device of claim 1 wherein the at least one first planarized material, the at least one second material, the at least one planarized third material, and the at least one core material comprise metals. ### Claim 5 (depends on 1) The device of claim 1 wherein at least one material of the at least one first planarized material, the at least one second material, the at least one third planarized material, and the at least one core material comprise a material selected from the group consisting of: (1) a polymer material, (2) a ceramic material, (3) a semiconductor material. ### Claim 6 (depends on 1) The device of claim 1 wherein the device is a microscopic device with features in range of a few microns. ### Claim 7 (depends on 1) The device of claim 1 wherein the device is a mesoscopic device.