# US 9,752,246 B2 · Film formation apparatus and film formation method forming metal film

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- Number: US 9,752,246 B2
- Document ID: US9752246B2
- Status: Granted
- Kind: B2
- Application number: 15/033,967
- Filed: 2014-11-12
- Published: 2016-09-15
- Granted: 2017-09-05
- Earliest claimed: 2013-11-14
- Assignees: Toyota Jidosha Kabushiki Kaisha
- Applicants: Toyota Jidosha Kabushiki Kaisha
- Inventors: Motoki Hiraoka; Hiroshi Yanagimoto; Yuki Sato
- Web page: https://patentgrep.com/patent/US9752246B2

## CPC

- C25D 5/06: Brush or pad plating
- C25D 17/00: Constructional parts, or assemblies thereof, of cells for electrolytic coating
- C25D 17/005: {Contacting devices}
- C25D 17/14: for pad-plating
- C25D 3/00: Electroplating: Baths therefor
- C25D 17/002: {Cell separation, e.g. membranes, diaphragms}
- C25D: PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR

## Abstract

Provided is film formation apparatus of a metal film and a film formation method therefor capable of forming a homogeneous metal film of a uniform thickness stably, while being less affected by the surface state of the anode. A film formation apparatus 1A includes: an anode 11; a solid electrolyte membrane 13 disposed between the anode 11 and a base B serving as a cathode; and a power supply unit 14 to apply voltage between the anode 11 and the base B, the film formation apparatus being configured so that, when the solid electrolyte membrane 13 is brought into contact with a surface of the base B, and voltage is applied between the anode 11 and the base B, metal is deposited on the surface of the base B from metal ions included inside of the solid electrolyte membrane 13, so that the metal film F made of the metal is formed. The film formation apparatus 1A includes a mounting base 21 on which the base B is to be placed, and the mounting base 21 has a suction unit 22 to suck the solid electrolyte membrane 13 from a side of the base B so that the solid electrolyte membrane 13 is brought into intimate contact with the surface of the base B during formation of the metal film F.

## Claims

### Claim 1

A film formation apparatus of a metal film comprising: an anode; a solid electrolyte membrane disposed between the anode and a base serving as a cathode; and a power supply unit to apply voltage between the anode and the base, the film formation apparatus being configured so that, when the solid electrolyte membrane is brought into contact with a surface of the base, and voltage is applied between the anode and the base, metal is deposited on the surface of the base from metal ions included inside of the solid electrolyte membrane, so that the metal film made of the metal is formed, wherein
the film formation apparatus comprises: a mounting base on which the base is to be placed, and a suction unit to suck the solid electrolyte membrane from a side of the base so that the solid electrolyte membrane is brought into intimate contact with the surface of the base placed on the mounting base during formation of the metal film.

### Claim 2 (depends on 1)

The film formation apparatus of a metal film according to claim 1, wherein a solution containing part is defined between the anode and the solid electrolyte membrane so as to store solution including the metal ions so that the solution including the metal ions comes into contact with the anode and the solid electrolyte membrane.

### Claim 3 (depends on 2)

The film formation apparatus of a metal film according to claim 2, further comprising a circulation mechanism in the solution containing part to circulate the solution including the metal ions.

### Claim 4 (depends on 1)

The film formation apparatus of a metal film according to claim 1, wherein the suction unit includes a plurality of membrane suction ports at a surface of the mounting base so as to suck the solid electrolyte membrane, and the plurality of membrane suction ports is along periphery of the base placed on the mounting base.

### Claim 5 (depends on 4)

The film formation apparatus of a metal film according to claim 4, wherein the membrane suction ports are formed so that each membrane suction port is covered with the periphery of the base partially when the base is placed on the mounting base.

### Claim 6 (depends on 4)

The film formation apparatus of a metal film according to claim 4
wherein
the suction unit includes a base suction port at the surface of the mounting base to suck the base placed on the mounting base toward the mounting base,
the base suction port is formed toward a center part of a surface of the base opposed to the mounting base when the base is placed on the mounting base, and
the suction unit further includes a membrane suction port opening/closing valve connected to the membrane suction ports so as to allow selection between suction and not-suction from the membrane suction ports, and a base suction port opening/closing valve connected to the base suction port so as to allow selection between suction and not-suction from the base suction port.

### Claim 7 (depends on 6)

The film formation apparatus of a metal film according to claim 6, wherein a plurality of the membrane suction port opening/closing valves are provided so as to allow the plurality of membrane suction ports to suck the solid electrolyte membrane at different timings.

### Claim 8 (depends on 1)

The film formation apparatus of a metal film according to claim 1, wherein the mounting base includes a storage recess to store the base when the metal film is formed on a surface of the base.

### Claim 9

A film formation method of a metal film comprising: disposing a solid electrolyte membrane between an anode and a base serving as a cathode; bringing the solid electrolyte membrane into contact with the base and applying voltage between the anode and the base, so as to deposit metal on a surface of the base from metal ions included inside of the solid electrolyte membrane, so that the metal film made of the metal is formed on the surface of the base, wherein
when the metal film is formed, the solid electrolyte membrane is sucked from a side of the base so that the solid electrolyte membrane is brought into intimate contact with the surface of the base.

### Claim 10 (depends on 9)

The film formation method of a metal film according to claim 9, wherein
the metal film is formed while storing solution including the metal ions between the anode and the solid electrolyte membrane so that the solution including the metal ions comes into contact with the anode and the solid electrolyte membrane.

### Claim 11 (depends on 9)

The film formation method of a metal film according to claim 9, wherein
the metal film is formed while circulating the solution including the metal ions stored between the anode and the solid electrolyte membrane.

### Claim 12 (depends on 9)

The film formation method of a metal film according to according to claim 9, wherein the solid electrolyte membrane is sucked from a position along periphery of the base.

### Claim 13 (depends on 12)

The film formation method of a metal film according to according to claim 12, wherein the metal film is formed while placing the base on a mounting base, and along with suction of the solid electrolyte membrane, the periphery of the base is sucked toward the mounting base.

### Claim 14 (depends on 12)

The film formation method of a metal film according to according to claim 12,
wherein
the base placed on the mounting base is sucked toward the mounting base at a center part of a surface of the base opposed to the mounting base, and
the solid electrolyte membrane is sucked to the base that is sucked to the mounting base.

### Claim 15 (depends on 14)

The film formation method of a metal film according to according to claim 14, wherein the solid electrolyte membrane is sucked at different positions along the periphery of the base while changing timings to suck the solid electrolyte membrane.

### Claim 16 (depends on 13)

The film formation method of a metal film according to according to claim 13,
wherein
the mounting base includes a storage recess to store the base, and
the metal film is formed on a surface of the base that is stored in the storage recess.
