# US 9,752,058 B2 · Electrically conductive adhesive agent, and method for connecting electronic component

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- Number: US 9,752,058 B2
- Document ID: US9752058B2
- Status: Granted
- Kind: B2
- Application number: 14/363,894
- Filed: 2012-12-10
- Published: 2014-10-30
- Granted: 2017-09-05
- Earliest claimed: 2011-12-15
- Assignees: Dexerials Corporation
- Applicants: Dexerials Corporation
- Inventors: Daisuke Sato; Ryosuke Odaka
- Web page: https://patentgrep.com/patent/US9752058B2

## CPC

- C09J 4/00: Adhesives based on organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond {; adhesives, based on monomers of macromolecular compounds of groups C09J183/00 - C09J183/16}
- C09J 4/06: {Organic non-macromolecular compounds having at least one polymerisable carbon-to-carbon unsaturated bond} in combination with a macromolecular compound other than an unsaturated polymer of groups C09J159/00 - C09J187/00
- C09J 5/06: involving heating of the applied adhesive
- C09J 7/22: Plastics; Metallised plastics
- C09J 7/35: Heat-activated
- C09J 9/02: Electrically-conducting adhesives
- C09J 11/04: inorganic
- C09J 133/14: of esters containing halogen, nitrogen, sulfur or oxygen atoms in addition to the carboxy oxygen
- H01B 1/22: the conductive material comprising metals or alloys
- H01B 13/00: Apparatus or processes specially adapted for manufacturing conductors or cables
- H05K 3/323: {by applying an anisotropic conductive adhesive layer over an array of pads}
- H05K 3/361: {Assembling flexible printed circuits with other printed circuits}
- C09J 2433/00: Presence of (meth)acrylic polymer
- H05K 2203/0425: Solder powder or solder coated metal powder
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H01B: CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES (selection for magnetic properties H01F1/00; waveguides H01P {; printed circuits H05K})
- H05K: PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS

## Abstract

There are provided an electrically conductive adhesive agent capable of providing good electrical continuity to a substrate to which a preflux treatment has been applied, and a method for connecting electronic components. The electrically conductive adhesive agent to be used includes a polymerizable acrylic compound, an organic peroxide, and the solder particles, the organic peroxide having a one minute half-life temperature lower than the solidus temperature of the solder particles. At the time of thermocompression bonding, the solder particles are crushed and an oxide film is removed, and a preflux layer on the surface of a bump is also removed by melting and flowing thereof, whereby electrical continuity is secured, and then an adhesive component is completely cured.

## Claims

### Claim 1

An electrically conductive adhesive agent, comprising a polymerizable acrylic compound, an organic peroxide, and solder particles,
wherein the above-mentioned organic peroxide has a one minute half-life temperature lower by more than 0 degrees C. and not more than 20 degrees C. than a solidus temperature of the above-mentioned solder particles.

### Claim 2 (depends on 1)

The electrically conductive adhesive agent according to claim 1, wherein the above-mentioned organic peroxide has a one minute half-life temperature of not more than 160 degrees C.

### Claim 3

A method for connecting electronic components, wherein
an electrically conductive adhesive agent is sandwiched between an electrode of a first electronic component to which a preflux treatment is applied and an electrode of a second electronic component,
wherein the electrically conductive adhesive agent contains a film forming resin, a polymerizable acrylic compound, an organic peroxide, and solder particles, wherein the organic peroxide has a one minute half-life temperature lower by more than 0 degrees C. and not more than 20 degrees C. than the solidus temperature of the solder particles; and
the first electronic component is thermally compression-bonded to the second electronic component, whereby the electrode of the first electronic component is electrically connected to the electrode of the second electronic component.

### Claim 4 (depends on 3)

The method for connecting electronic components according to claim 3, wherein the above-mentioned first electronic component is thermally compression-bonded to the above-mentioned second electronic component at a pressure of 2 to 3 MPa.

### Claim 5 (depends on 1)

The electrically conductive adhesive agent according to claim 1, wherein the above-mentioned organic peroxide has a one minute half-life temperature of not more than 160 degrees C.

### Claim 6 (depends on 3)

The method for connecting electronic components according to claim 3, wherein the above-mentioned first electronic component is thermally compression-bonded to the above-mentioned second electronic component at a pressure of 2 to 3 MPa.