# US 9,752,032 B2 · Curable silicone composition, cured product thereof, and optical semiconductor device

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- Number: US 9,752,032 B2
- Document ID: US9752032B2
- Status: Granted
- Kind: B2
- Application number: 14/655,581
- Filed: 2013-12-24
- Published: 2015-12-03
- Granted: 2017-09-05
- Earliest claimed: 2012-12-28
- Assignees: Dow Corning Toray Co., Ltd.
- Applicants: Dow Corning Toray Co., Ltd.
- Inventors: Kazuhiro Nishijima; Takashi Sagawa; Tomohiro Iimura; Michitaka Suto; Kasumi Takeuchi; Haruhiko Furukawa; Yoshitsugu Morita
- Web page: https://patentgrep.com/patent/US9752032B2

## CPC

- C08L 83/04: Polysiloxanes
- C08G 77/14: containing silicon bound to oxygen-containing groups
- C08L 83/06: containing silicon bound to oxygen-containing groups (C08L83/12 takes precedence)
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10W 72/884: {Die-attach connectors and bond wires}
- H10W 74/00: Encapsulations, e.g. protective coatings
- H10W 90/736: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- H10W 90/756: {between a chip and a stacked lead frame, conducting package substrate or heat sink}
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane resin having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organosiloxane (C1) having silicon-bonded hydrogen atoms at both molecular terminals, an organopolysiloxane (C2) having at least two silicon-bonded hydrogen atoms in a molecule, or a mixture of components (C1) and (C2); and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handleability and can form a cured product with a high refractive index and low gas permeability when cured.

## Claims

### Claim 1

A curable silicone composition comprising:
(A) 100 parts by mass of an organopolysiloxane resin having at least two alkenyl groups in a molecule and represented by the average unit formula:
(R1R22SiO1/2)a(R32SiO2/2)b(R4SiO3/2)c
wherein R1 is an alkenyl group having from 2 to 12 carbons; R2 are the same or different, and are each an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, or an aralkyl group having from 7 to 20 carbons; R3 are the same or different, and are each an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, or a phenyl group; R4 is an aryl group having from 6 to 20 carbons or an aralkyl group having from 7 to 20 carbons; and a, b, and c are numbers that satisfy such that 0.01≦a≦0.5, 0≦b≦0.7, 0.1≦c<0.9, and a+b+c=1;
(B) from 5 to 150 parts by mass of an organopolysiloxane represented by the general formula:
wherein R1 is as defined above; R5 are the same or different, and are each an alkyl group having from 1 to 12 carbon atoms or a phenyl group; R6 is an alkyl group having from 1 to 12 carbon atoms; and m is an integer from 1 to 100, n is an integer from 0 to 50, where m≧n and 1≦m+n≦100;
(C) is an organosiloxane (C1) represented by the general formula:
HMe2SiOPh2SiOSiMe2H; or
HMe2SiO(Ph2SiO)2.5SiMe2H;
wherein Me represents a methyl group and Ph represents a phenyl group; or
(C) is a mixture of the organosiloxane (C1) and an organopolysiloxane (C2) having at least two silicon-bonded hydrogen atoms in a molecule and represented by the average unit formula:
(HR5R6SiO1/2)d(HR62SiO1/2)e(R52SiO2/2)f(R4SiO3/2)g
wherein R4, R5, and R6 are as defined above; and d, e, f, and g are numbers that satisfy such that 0.01≦d≦0.7, 0≦e≦0.5, 0≦f≦0.7,
0.1≦g<0.9, and d+e+f+g=1;
wherein component (C) is present in the silicone composition in an amount such that the number of silicon-bonded hydrogen atoms in component (C) is from 0.1 to 5 moles per 1 mol of total alkenyl groups in components (A) and (B); and
(D) an effective amount of a hydrosilylation reaction catalyst.

### Claim 2 (depends on 1)

The curable silicone composition according to claim 1, wherein R2 in component (A) is a phenyl group or a naphthyl group.

### Claim 3 (depends on 1)

The curable silicone composition according to claim 1, wherein R4 in component (A) is a phenyl group or a naphthyl group.

### Claim 4 (depends on 1)

The curable silicone composition according to claim 1, wherein R4 in component (C2) is a phenyl group or a naphthyl group.

### Claim 5 (depends on 1)

The curable silicone composition according to claim 1, wherein in the mixture of components (C1) and (C2), a mass ratio of component (C1) to component (C2) is from 0.5:9.5 to 9.5:0.5.

### Claim 6 (depends on 1)

A cured product produced by curing the curable silicone composition according to claim 1.

### Claim 7 (depends on 1)

An optical semiconductor device comprising an optical semiconductor element sealed by a cured product of the curable silicone composition according to claim 1.

### Claim 8 (depends on 2)

The curable silicone composition according to claim 2, wherein R4 in component (A) is a phenyl group or a naphthyl group.

### Claim 9 (depends on 2)

The curable silicone composition according to claim 2, wherein R4 in component (C2) is a phenyl group or a naphthyl group.

### Claim 10 (depends on 3)

The curable silicone composition according to claim 3, wherein R4 in component (C2) is a phenyl group or a naphthyl group.

### Claim 11 (depends on 2)

The curable silicone composition according to claim 2, wherein in the mixture of components (C1) and (C2), a mass ratio of component (C1) to component (C2) is from 0.5:9.5 to 9.5:0.5.

### Claim 12 (depends on 3)

The curable silicone composition according to claim 3, wherein in the mixture of components (C1) and (C2), a mass ratio of component (C1) to component (C2) is from 0.5:9.5 to 9.5:0.5.

### Claim 13 (depends on 4)

The curable silicone composition according to claim 4, wherein in the mixture of components (C1) and (C2), a mass ratio of component (C1) to component (C2) is from 0.5:9.5 to 9.5:0.5.

### Claim 14 (depends on 1)

The curable silicone composition according to claim 1, wherein 0.05≦a≦0.4, 0≦b≦0.4, 0.45≦c<0.8, and a+b+c=1.

### Claim 15 (depends on 1)

The curable silicone composition according to claim 1, wherein m is an integer from 1 to 75 and n is an integer from 0 to 25, where m≧n and 1≦m+n≦75.

### Claim 16 (depends on 1)

The curable silicone composition according to claim 1, wherein m is an integer from 1 to 50 and n is an integer from 0 to 25, where m≧n and 1≦m+n≦50.

### Claim 17 (depends on 1)

The curable silicone composition according to claim 1, wherein p is an integer from 0 to 10.

### Claim 18 (depends on 1)

The curable silicone composition according to claim 1, wherein 0.2≦d≦0.7, 0≦e≦0.4, 0≦f<0.5, 0.25≦g<0.7, and d+e+f+g=1.

### Claim 19 (depends on 17)

The curable silicone composition according to claim 17, wherein 0.2≦d≦0.7, 0≦e≦0.4, 0≦f<0.5, 0.25≦g<0.7, and d+e+f+g=1.

### Claim 20 (depends on 1)

The curable silicone composition according to claim 1, wherein component C2 has a mass average molecular weight in terms of standard polystyrene, as measured by gel permeation chromatography, from 500 to 10,000.