# US 9,752,028 B2 · Halogen-free thermosetting resin composition, prepreg and laminate for printed circuit prepared from the same > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,752,028 B2 - Document ID: US9752028B2 - Status: Granted - Kind: B2 - Application number: 14/679,387 - Filed: 2015-04-06 - Published: 2016-06-30 - Granted: 2017-09-05 - Earliest claimed: 2014-12-29 - Assignees: Shengyi Technology Co., Ltd. - Applicants: Shengyi Technology Co., Ltd. - Inventors: Jiang You; Tianhui Huang; Zhongqiang Yang - Web page: https://patentgrep.com/patent/US9752028B2 ## CPC - C08L 63/04: Epoxynovolacs - C08G 59/4071: {phosphorus containing compounds} - C08G 59/621: {Phenols} - C08K 3/36: Silica - C08K 5/0066: {Flame-proofing or flame-retarding additives} - C08K 5/523: with hydroxyaryl compounds - C08L 63/00: Compositions of epoxy resins; Compositions of derivatives of epoxy resins - C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06) - C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS - C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09) ## Abstract The present invention relates to a halogen-free thermosetting resin composition, and also a prepreg and a laminate for printed circuit prepared from the halogen-free thermosetting resin composition. The halogen-free thermosetting resin composition comprises, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 5 to 30 parts by weight of a first curing agent of phosphorus-containing bisphenol, (C) from 5 to 30 parts by weight of a second curing agent of alkylphenol novolac, and (D) a phosphorus-containing flame retardant. The prepreg and laminate for printed circuit prepared from the halogen-free thermosetting resin composition according to the present invention have high glass transition temperature, excellent dielectric properties, low water absorption, high thermal resistance and better process workability, and can fulfill halogen-free flame retardance and achieve the grade of UL94 V-0. ## Claims ### Claim 1 A halogen-free thermosetting resin composition, consisting of, based on 100 parts by weight of organic solids, (A) from 30 to 60 parts by weight of a halogen-free epoxy resin, (B) from 5 to 30 parts by weight of a first curing agent of phosphorus-containing bisphenol; (C) from 5 to 30 parts by weight of a second curing agent of alkylphenol novolac; (D) a phosphorus-containing flame retardant; and (E) optionally one or more liquid solvents; the phosphorus-containing bisphenol has the following structure wherein n2 is an integer of 2 to 20; and the alkylphenol novolac has the following structure wherein R3, R4 and R5 are all independently selected from substituted or unsubstituted linear or branched alkyl groups having 4-8 carbon atoms; and n3 is an integer from 2 to 20. ### Claim 2 (depends on 1) The halogen-free thermosetting resin composition according to claim 1, characterized in that the halogen-free epoxy resin is one selected from or a mixture of at least two selected from bisphenol-A epoxy resin, bisphenol-F epoxy resin, o-cresol novolac epoxy resin, bisphenol-A novolac epoxy resin, trisphenol novolac epoxy resin, dicyclopentadiene novolac epoxy resin, biphenyl novolac epoxy resin, alkylbenzene novolac epoxy resin and naphthol novolac epoxy resin. ### Claim 3 (depends on 2) The halogen-free thermosetting resin composition according to claim 2, characterized in that the halogen-free epoxy resin is selected from the epoxy resin having the following structure, wherein, X1, X2 and X3 are each independently selected from R1 is selected from hydrogen atom, substituted or unsubstituted C1-C5 linear alkyl, and substituted or unsubstituted C1-C5 branched alkyl; Y1 and Y2 are each independently selected from single bonds, —CH2—, wherein n1 is an integer from 1 to 10; R2 is selected from hydrogen atom, substituted or unsubstituted C1-C5 linear alkyl, and substituted or unsubstituted C1-C5 branched alkyl. ### Claim 4 (depends on 2) A prepreg comprising a reinforcing material and a halogen-free thermosetting resin composition according to claim 2 which is attached thereon after impregnation and drying. ### Claim 5 (depends on 4) A laminate comprising at least one prepreg according to claim 4. ### Claim 6 (depends on 1) The halogen-free thermosetting resin composition according to claim 1, characterized in that the phosphorus-containing bisphenol has a weight average molecular weight of from 1000 to 6500. ### Claim 7 (depends on 1) The halogen-free thermosetting resin composition according to claim 1, characterized in that, based on 100 parts of weight of the addition amount of the sum of components (A), (B) and (C), the component (D) is added in an amount of from 5 to 50 parts by weight. ### Claim 8 (depends on 1) A prepreg comprising a reinforcing material and a halogen-free thermosetting resin composition according to claim 1 which is attached thereon after impregnation and drying. ### Claim 9 (depends on 8) A laminate comprising at least one prepreg according to claim 8. ### Claim 10 (depends on 1) The halogen-free thermosetting resin composition according to claim 1, characterized in that the phosphorus-containing flame retardant is one selected from or a mixture of at least two selected from tri-(2,6-dimethylphenyl)-phosphine, 10-(2,5-dihydroxylphenyl)-9,10-dihydro-9-oxa-10- phosphaphenanthrene-10-oxide, 2,6-di-(2,6-dimethylphenyl) phosphine benzene, 10-phenyl -9,10-dihydro-9-oxa-10-phosphaphenanthrene-10-oxide, phenoxyphosphazene compound, phosphate, polyphosphate, polyphosphonate and phosphonate-carbonate copolymers.