# US 9,752,006 B2 · Polyamide resin composition and molded article

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- Number: US 9,752,006 B2
- Document ID: US9752006B2
- Status: Granted
- Kind: B2
- Application number: 14/972,847
- Filed: 2015-12-17
- Published: 2016-06-23
- Granted: 2017-09-05
- Earliest claimed: 2014-12-18
- Assignees: Asahi Kasei Kabushiki Kaisha
- Applicants: Asahi Kasei Chemicals Corporation
- Inventors: Teruaki Sakuma; Kazunori Terada
- Web page: https://patentgrep.com/patent/US9752006B2

## CPC

- C08K 3/16: Halogen-containing compounds
- C08K 5/17: Amines; Quaternary ammonium compounds
- C08K 3/013: Fillers, pigments or reinforcing additives
- C08K 5/098: Metal salts of carboxylic acids
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)

## Abstract

A polyamide resin composition including a polyamide resin (A), a copper compound (B), a bromide of an alkali metal and/or a bromide of an alkaline earth metal (C), and a secondary amine compound (D).

## Claims

### Claim 1

A polyamide resin composition comprising:
a polyamide resin (A) in 64.05 to 99.86% by mass with respect to 100% by mass of the polyamide resin composition,
a copper compound (B) in 0.03 to 0.1% by mass with respect to 100% by mass of the polyamide resin composition, wherein the copper compound (B) is a copper halide compound,
a bromide of an alkali metal (C) in 0.05 to 5% 0.17 to 0.6% by mass with respect to 100% by mass of the polyamide resin composition, and
a secondary amine compound (D) comprising an aromatic secondary amine compound in 0.1 to 0.2% by mass with respect to 100% by mass of the polyamide resin composition,
wherein the mass ratio of the bromide of an alkali metal (C) to the secondary amine compound (D) in the polyamide resin composition is 50/1 to 1/50.

### Claim 2 (depends on 1)

The polyamide resin composition according to claim 1, wherein a molar ratio of a halogen element/a copper element, in the polyamide resin composition is 2/1 to 50/1.

### Claim 3 (depends on 1)

The polyamide resin composition according to claim 1, further comprising at least one fatty acid compound (E) selected from the group consisting of fatty acid esters, fatty acid amides, and fatty acid metal salts.

### Claim 4 (depends on 3)

The polyamide resin composition according to claim 3, wherein the fatty acid compound (E) has an acid value of 10 mgKOH/g or less.

### Claim 5 (depends on 3)

The polyamide resin composition according to claim 3, wherein the fatty acid compound (E) is a higher fatty acid metal salt with a metal content of 3.5 to 11.5% by mass.

### Claim 6 (depends on 1)

The polyamide resin composition according to claim 1, wherein the content of the copper element in the polyamide resin composition is 0.005% by mass or more with respect to the total mass of the polyamide resin composition.

### Claim 7 (depends on 1)

The polyamide resin composition according to claim 1, further comprising an inorganic filler (F).

### Claim 8 (depends on 1)

A molded article comprising a polyamide resin composition according to claim 1.

### Claim 9 (depends on 8)

The molded article according to claim 8, wherein the molded article is a vehicle part.

### Claim 10 (depends on 1)

The polyamide resin composition according to claim 1, further comprising at least one fatty acid compound (E) in 0.01 to 10% by mass with respect to 100% by mass of the polyamide resin composition.