# US 9,751,989 B2 · Condensation curable resin composition and semiconductor package

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- Number: US 9,751,989 B2
- Document ID: US9751989B2
- Status: Granted
- Kind: B2
- Application number: 15/361,537
- Filed: 2016-11-28
- Published: 2017-06-22
- Granted: 2017-09-05
- Earliest claimed: 2015-12-22
- Assignees: Shin-Etsu Chemical Co., Ltd.
- Applicants: Shin-Etsu Chemical Co., Ltd.
- Inventors: Takayuki Kusunoki
- Web page: https://patentgrep.com/patent/US9751989B2

## CPC

- C08G 77/52: containing aromatic rings
- C08K 5/56: Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
- C08L 83/14: in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms (C08L83/10 takes precedence)
- H10H 20/854: characterised by their material, e.g. epoxy or silicone resins
- H10W 74/476: {Organic materials comprising silicon}
- C08G 77/16: to hydroxy groups
- C08G 77/18: to alkoxy or aryloxy groups
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- H10H: INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

A condensation curable resin composition comprising a silphenylene oligomer skeleton-bearing organosilicon compound having at least two hydroxyl and/or alkoxy groups per molecule cures into a product having both a satisfactory hardness and crack resistance.

## Claims

### Claim 1

A condensation curable resin composition comprising (A) a silphenylene oligomer skeleton-bearing organosilicon compound having at least two hydroxyl and/or alkoxy groups per molecule, represented by the general formula (1):
(R13SiO0.5)a(R12SiO)b(R1SiO1.5)c(SiO2)dZe(O0.5R2)f (1)
wherein R1 is independently hydrogen or a C1-C12 unsubstituted monovalent hydrocarbon group free of aliphatic unsaturation,
Z is independently a group having the formula (2):
wherein R3 is independently a C1-C12 unsubstituted monovalent hydrocarbon group free of aliphatic unsaturation, and n is an integer of 1 to 3,
R2 is independently hydrogen or a C1-C6 alkyl group,
a is an integer of 0 to 500, b is an integer of 0 to 5,000, c is an integer of 0 to 500, d is an integer of 0 to 500, e is an integer of 1 to 500, and f is an integer of 2 to 100.

### Claim 2 (depends on 1)

The composition of claim 1 wherein component (A) comprises (A-i) a silphenylene oligomer skeleton-bearing branched organosilicon compound having at least two hydroxyl and/or alkoxy groups per molecule, represented by formula (1) wherein b is an integer of 0 to 1,000, and 1≦c+d≦1,000.

### Claim 3 (depends on 1)

The composition of claim 1 wherein component (A) comprises (A-ii) a silphenylene oligomer skeleton-bearing linear organosilicon compound having hydroxyl and/or alkoxy groups at both ends of the molecular chain, represented by the general formula (3):
(R12SiO)b′Ze′(O0.5R2)2 (3)
wherein R1, R2 and Z are as defined above, b′ is an integer of 0 to 5,000, e′ is an integer of 1 to 500, and 1≦b′+e′≦5,001.

### Claim 4 (depends on 1)

The composition of claim 1, further comprising (B) an organosilicon compound having at least two hydroxyl and/or alkoxy groups per molecule, represented by the general formula (4):
(R13SiO0.5)g(R12SiO)h(R1SiO1.5)k(SiO2)p(O0.5R2)q (4)
wherein R1 and R2 are as defined above, g is an integer of 0 to 500, h is an integer of 0 to 5,000, k is an integer of 0 to 500, p is an integer of 0 to 500, q is an integer of 2 to 100, and 1≦h+k+p≦5,000, in an amount of 5 to 500 parts by weight per 100 parts by weight of component (A) in total.

### Claim 5 (depends on 4)

The composition of claim 4 wherein component (B) comprises (B-i) a branched organosilicon compound having at least two hydroxyl and/or alkoxy groups per molecule, represented by formula (4) wherein h is an integer of 0 to 1,000, and 1≦k+p≦1,000, in an amount of 50 to 500 parts by weight per 100 parts by weight of component (A) in total.

### Claim 6 (depends on 4)

The composition of claim 4 wherein component (B) comprises (B-ii) a linear organosilicon compound having hydroxyl and/or alkoxy groups at both ends of the molecular chain, represented by the general formula (5):
(R12SiO)h′(O0.5R2)2 (5)
wherein R1 and R2 are as defined above, and h′ is an integer of 1 to 5,000, in an amount of 5 to 200 parts by weight per 100 parts by weight of component (A) in total.

### Claim 7 (depends on 1)

The composition of claim 1, further comprising (C) a condensation catalyst.

### Claim 8 (depends on 1)

A semiconductor package encapsulated with a cured product of the condensation curable resin composition of claim 1.