# US 9,751,988 B2 · Reactive silicone composition, hotmelt material made therefrom, and curable hotmelt composition

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 9,751,988 B2
- Document ID: US9751988B2
- Status: Granted
- Kind: B2
- Application number: 15/115,923
- Filed: 2015-02-16
- Published: 2017-06-15
- Granted: 2017-09-05
- Earliest claimed: 2014-02-19
- Assignees: Dow Corning Toray Co., Ltd.; Dow Corning Corporation
- Applicants: Dow Corning Corporation; Dow Corning Toray Co., Ltd.
- Inventors: Gunn Jo; Haruna Yamazaki; Ju Young Yook; Makoto Yoshitake
- Web page: https://patentgrep.com/patent/US9751988B2

## CPC

- C08G 77/38: Polysiloxanes modified by chemical after-treatment
- C08K 3/22: of metals
- C08K 5/56: Organo-metallic compounds, i.e. organic compounds containing a metal-to-carbon bond
- C08L 83/00: Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L 83/04: Polysiloxanes
- C09J 183/04: Polysiloxanes
- C08G 77/08: characterised by the catalysts used
- C08G 77/12: containing silicon bound to hydrogen
- C08G 77/16: to hydroxy groups
- C08G 77/20: containing silicon bound to unsaturated aliphatic groups
- C08G 77/70: {Siloxanes defined by use of the MDTQ nomenclature}
- C08G 2170/20: Compositions for hot melt adhesives
- C08K 2201/00: Specific properties of additives
- H10W 74/476: {Organic materials comprising silicon}
- C08G: MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08K: Use of inorganic or non-macromolecular organic substances as compounding ingredients (paints, inks, varnishes, dyes, polishes, adhesives C09)
- C08L: COMPOSITIONS OF MACROMOLECULAR COMPOUNDS (compositions based on polymerisable monomers C08F, C08G; artificial filaments or fibres D01F; textile treating compositions D06)
- C09J: ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES (preparation of glue or gelatine C09H)
- H10W: GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10

## Abstract

This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.

## Claims

### Claim 1

A reactive silicone composition for forming a hotmelt material, comprising:
(A) an organopolysiloxane resin represented by the following average unit formula:
(R13SiO1/2)a(R12SiO2/2)b(R1SiO3/2)c(SiO4/2)d(R2O1/2)e
wherein each R1 independently is a monovalent hydrocarbon group having 1 to 10 carbon atoms, with the proviso that 4 to 12 mol % of all R1 in a molecule are alkenyl groups; R2 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; and a, b, c, d, and e are numbers that satisfy: 0.35≦a≦0.60; 0≦b≦0.1; 0≦c≦0.1; 0.40≦d≦0.65; 0≦e≦0.05; and a+b+c+d=1, in an amount of 15 to 50% by mass of total amount of components (A) to (C);
(B) an organopolysiloxane resin represented by the following average unit formula:
(R33SiO1/2)f(R32SiO2/2)g(R3SiO3/2)h(SiO4/2)i(R4O1/2)j
wherein each R3 independently is a monovalent hydrocarbon group having 1 to 10 carbon atoms except for an alkenyl group; R4 is a hydrogen atom or an alkyl group having 1 to 10 carbon atoms; and f, g, h, i, and j are numbers that satisfy: 0.35≦f≦0.55; 0≦g≦0.2; 0≦h≦0.2; 0.45≦i≦0.65; 0≦j≦0.05; and
f+g+h+i=1, in an amount of 20 to 45% by mass of total amount of components (A) to (C);
(C) a diorganopolysiloxane represented by the following average formula:
R53SiO(SiR52O)kSiR53
wherein each R5 independently is a monovalent hydrocarbon group having 1 to 10 carbon atoms, with the proviso that at least two R5 in a molecule are alkenyl groups; and
k is a number of 20 to 5,000, in an amount of 10 to 40% by mass of total amount of components (A) to (C);
(D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule, in an amount that component (D) gives 0.1 to 0.6 silicon-bonded hydrogen atoms per one alkenyl group in components (A) and (C);
(E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule, in an amount that component (E) gives 0.1 to 0.5 silicon-bonded hydrogen atoms per one alkenyl group in components (A) and (C); and
(F) a hydrosilylation catalyst in a sufficient amount to conduct a hydrosilylation of the composition.

### Claim 2 (depends on 1)

The reactive silicone composition according to claim 1, further comprising (G) a phosphor, in an amount of 10 to 400 parts by mass per 100 parts by mass of the sum of components (A) to (F).

### Claim 3 (depends on 1)

A hotmelt material obtained by conducting a hydrosilylation reaction of the composition according to claim 1.

### Claim 4 (depends on 1)

A curable hotmelt composition comprising: the hotmelt material obtained by conducting a hydrosilylation reaction of the reactive silicone composition according to claim 1, and (H) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, in an amount that component (H) gives 0.1 to 0.8 silicon-bonded hydrogen atoms per one alkenyl group in components (A) and (C) in the reactive silicone composition.

### Claim 5 (depends on 2)

A hotmelt material obtained by conducting a hydrosilylation reaction of the composition according to claim 2.

### Claim 6 (depends on 2)

A curable hotmelt composition comprising: the hotmelt material obtained by conducting a hydrosilylation reaction of the reactive silicone composition according to claim 2, and (H) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule, in an amount that component (H) gives 0.1 to 0.8 silicon-bonded hydrogen atoms per one alkenyl group in components (A) and (C) in the reactive silicone composition.