# US 9,751,756 B2 · Method and system for CMOS based MEMS bump stop contact damage prevention > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,751,756 B2 - Document ID: US9751756B2 - Status: Granted - Kind: B2 - Application number: 14/451,092 - Filed: 2014-08-04 - Published: 2015-10-15 - Granted: 2017-09-05 - Earliest claimed: 2014-04-14 - Assignees: Apple Inc. - Applicants: Apple Inc. - Inventors: Milind S. Bhagavat; Richard Yeh; Henry H. Yang - Web page: https://patentgrep.com/patent/US9751756B2 ## CPC - B81C 1/00825: {Protect against mechanical threats, e.g. against shocks, or residues (B81C1/00261 take precedence)} - B81B 2203/0118: Cantilevers - B81B 2207/115: Protective layers applied directly to the device before packaging - B81C: PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS (making microcapsules or microballoons B01J13/02; processes or apparatus specially adapted for the manufacture or treatment of piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/01) - B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00) ## Abstract In some embodiments, a microelectromechanical system may include a semiconductor substrate, a plurality of wiring layers, and a stop. The plurality of wiring layers may be coupled to a first surface of the semiconductor substrate. The stop may be coupled to the plurality of wiring layers. In some embodiments, at least a portion of the plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material. In some embodiments, at least the portion excludes wiring within. In some embodiments, a volume of the portion may be determined by a use of the microelectromechanical system. In some embodiments, the portion may inhibit, during use, electrical failures adjacent to the stop. ## Claims ### Claim 1 A microelectromechanical system, comprising: a semiconductor substrate comprising a first surface; a plurality of wiring layers coupled to the first surface of the semiconductor substrate, wherein at least a part of the plurality of wiring layers are stacked relative to each other; and a stop coupled directly to the plurality of wiring layers, wherein at least a portion of the stacked plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material and excludes wiring within at least the portion such that wiring from the plurality of wiring layers extend around the insulating material between the stop and the first surface of the substrate. ### Claim 2 (depends on 1) The system of claim 1, wherein all of the plurality of wiring layers between the stop and the first surface of the substrate is formed from an insulating material and excludes wiring. ### Claim 3 (depends on 1) The system of claim 1, wherein the stop inhibits, during use, contact of a movable portion of the system from contacting the plurality of wiring layers with excessive force. ### Claim 4 (depends on 1) The system of claim 1, wherein a volume of the portion is determined by a use of the microelectromechanical system. ### Claim 5 (depends on 1) The system of claim 1, wherein a volume of the portion is determined by a relative motion within the microelectromechanical system relative to the stop. ### Claim 6 (depends on 1) The system of claim 1, wherein the portion inhibits, during use, electrical failures adjacent to the stop. ### Claim 7 (depends on 1) The system of claim 1, wherein the portion inhibits, during use, electrical failures adjacent to the stop associated with structural failures within the portion. ### Claim 8 (depends on 1) The system of claim 1, wherein the portion inhibits, during use, structural failures adjacent to the stop using the portion, and wherein the structural failures result from ion bombardment. ### Claim 9 (depends on 1) The system of claim 1, wherein the insulating material comprises an electrically nonconductive material. ### Claim 10 (depends on 1) The system of claim 1, wherein the microelectromechanical system comprises an accelerometer, a gyroscope, a microphone, or a pressure sensor. ### Claim 11 A microelectromechanical system, comprising: a semiconductor substrate comprising a first surface; a plurality of wiring layers coupled to the first surface of the semiconductor substrate, wherein at least a part of the plurality of wiring layers are stacked relative to each other; and a stop coupled directly to the plurality of wiring layers, wherein at least a portion of the stacked plurality of wiring layers between the stop and the first surface of the substrate comprises an insulating material such that wiring from the plurality of wiring layers extend around the insulating material between the stop and the first surface of the substrate, wherein a volume of the portion is determined by a relative motion within the microelectromechanical system relative to the stop, and wherein the stop inhibits, during use, contact of a movable portion of the system from contacting the plurality of wiring layers with excessive force. ### Claim 12 (depends on 11) The system of claim 11, wherein all of the portion of the plurality of wiring layers between the stop and the first surface of the substrate excludes wiring within at least the portion. ### Claim 13 (depends on 11) The system of claim 11, wherein a volume of the portion is determined by a use of the microelectromechanical system. ### Claim 14 (depends on 11) The system of claim 11, wherein the portion inhibits, during use, electrical failures adjacent to the stop. ### Claim 15 (depends on 11) The system of claim 11, wherein the portion inhibits, during use, electrical failures adjacent to the stop associated with structural failures within the portion. ### Claim 16 (depends on 11) The system of claim 11, wherein the portion inhibits, during use, structural failures adjacent to the stop using the portion, and wherein the structural failures result from ion bombardment. ### Claim 17 (depends on 11) The system of claim 11, wherein the insulating material comprises an electrically nonconductive material. ### Claim 18 (depends on 11) The system of claim 11, wherein the microelectromechanical system comprises an accelerometer, a gyroscope, a microphone, or a pressure sensor. ### Claim 19 (depends on 1) The system of claim 1, wherein the plurality of wiring layers extends below the insulating material. ### Claim 20 (depends on 11) The system of claim 11, wherein the plurality of wiring layers extends below the insulating material.