# US 9,751,751 B2 · Micromechanical component and method for manufacturing same

> Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt

- Number: US 9,751,751 B2
- Document ID: US9751751B2
- Status: Granted
- Kind: B2
- Application number: 14/734,791
- Filed: 2015-06-09
- Published: 2015-12-17
- Granted: 2017-09-05
- Earliest claimed: 2014-06-13
- Assignees: Robert Bosch GmbH
- Applicants: Robert Bosch GmbH
- Inventors: Jochen Reinmuth; Johannes Classen
- Web page: https://patentgrep.com/patent/US9751751B2

## CPC

- B81B 7/0038: {using materials for controlling the level of pressure, contaminants or moisture inside of the package, e.g. getters}
- B81B 7/007: {Interconnections between the MEMS and external electrical signals}
- B81B 2201/025: Inertial sensors not provided for in B81B2201/0235 - B81B2201/0242
- B81B 2207/092: Buried interconnects in the substrate or in the lid
- B81B: MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES (piezoelectric, electrostrictive or magnetostrictive elements per se H10N30/00, H10N35/00)

## Abstract

A micromechanical component includes a sensor chip and a cap chip connected to the sensor chip. A cavity is formed between the sensor chip and the cap chip. The sensor chip has a movable element situated in the cavity. The cap chip has a wiring level containing an electrically conductive electrode. The cap chip has a getter element situated in the cavity.

## Claims

### Claim 1

A micromechanical component, comprising:
a sensor chip; and
a cap chip connected to the sensor chip;
wherein:
a cavity is formed between the sensor chip and the cap chip,
the sensor chip has a movable element situated in the cavity,
the cap chip has a wiring level including an electrically conductive electrode,
the cap chip has a getter element situated in the cavity,
the getter element is electrically conductively connected to the electrode, and
the getter element is configured to excite movement of the movable element.

### Claim 2 (depends on 1)

The micromechanical component as recited in claim 1, wherein the getter element has a first section and a second section electrically insulated from one another, the first section being electrically conductively connected to the electrode, and the second section being electrically conductively connected to another electrode.

### Claim 3 (depends on 1)

The micromechanical component as recited in claim 1, wherein the getter element is situated at least partially opposite the movable element in the cavity.

### Claim 4 (depends on 1)

The micromechanical component as recited in claim 1, wherein the cap chip has a stop element, and wherein a distance of the getter element from the movable element is greater than a distance of the stop element from the movable element.

### Claim 5 (depends on 4)

The micromechanical component as recited in claim 4, wherein the stop element is formed in an insulator level which at least partially covers the wiring level.

### Claim 6 (depends on 4)

The micromechanical component as recited in claim 4, wherein the stop element is electrically conductive.

### Claim 7

A method for manufacturing a micromechanical component, comprising:
providing a sensor chip with a movable element;
providing a cap chip with a wiring level, including an electrically conductive electrode;
arranging a getter element on the cap chip; and
connecting the sensor chip to the cap chip in such a way that a cavity is formed between the sensor chip and the cap chip, the movable element and the getter element being situated in the cavity, wherein the getter element is electrically conductively connected to the electrode, and wherein the getter element is configured to excite movement of the movable element.

### Claim 8 (depends on 7)

The method as recited in claim 7, further comprising:
removing a portion of at least one of another wiring level and an insulator level on the top side of the cap chip to form a recess, wherein the getter element is situated in the recess.

### Claim 9 (depends on 1)

The micromechanical component as recited in claim 1, wherein the getter element is further configured to detect movement of the movable element.

### Claim 10 (depends on 7)

The method of as recited in claim 7, wherein the getter element is further configured to detect movement of the movable element.