# US 9,751,254 B2 · Apparatus for treating substrates > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,751,254 B2 - Document ID: US9751254B2 - Status: Granted - Kind: B2 - Application number: 13/632,597 - Filed: 2012-10-01 - Published: 2013-01-31 - Granted: 2017-09-05 - Earliest claimed: 2008-10-09 - Assignees: Bobst Manchester Ltd - Applicants: Gary Barlow; Nicholas Copeland - Inventors: Gary Barlow; Nicholas Copeland - Web page: https://patentgrep.com/patent/US9751254B2 ## CPC - B29C 59/14: by plasma treatment {(plasma tubes per se H01J)} - C23C 14/564: {Means for minimising impurities in the coating chamber such as dust, moisture, residual gases} - H01J 37/32009: {Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources (plasma generation in general H05H1/24)} - H01J 37/32541: {Shape} - H01J 37/32568: {Relative arrangement or disposition of electrodes; moving means} - H01J 37/34: operating with cathodic sputtering (H01J37/36 takes precedence {; methods of cathodic sputtering C23C14/34}) - B29C: SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING (making preforms B29B11/00; making laminated products by combining previously unconnected layers which become one product whose layers will remain together B32B37/00 - B32B41/00) - C23C: COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL (making metal-coated products by extrusion B21C23/22; covering with metal by connecting pre-existing layers to articles, see the relevant places, e.g. B21D39/00, B23K; metallising of glass C03C; metallising mortars, concrete, artificial stone, ceramics or natural stone C04B41/00; enamelling of, or applying a vitreous layer to, metals C23D; treating metal surfaces or coating of metals by electrolysis or electrophoresis C25D; single-crystal film growth C30B; by metallising textiles D06M11/83; decorating textiles by locally metallising D06Q1/04) - H01J: ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS (spark-gaps H01T; electric arc lamps H05B31/00; particle accelerators H05H) ## Abstract Apparatus for coating a substrate with a material in a chamber subject, during use, to substantial evacuation, which includes a coating station within the chamber for coating a substrate by sputtering and/or by evaporation; at least one treating station disposed in serial with the coating station and equipped with a plasma treater incorporating a plasma generator in sufficient proximity to the substrate to treat the substrate; a magnetic device for generating a magnetic field; at least one cylindrical electrode surrounding the magnetic device, the plasma treater incorporates a device for rotating the electrode about its longitudinal axis. ## Claims ### Claim 1 An apparatus for coating a substrate with a material in a chamber subject, during use, to substantial evacuation, the apparatus comprising: a coating station within said chamber configured and operable for coating a substrate by evaporation at a first pressure; at least one treating station disposed in series with and segregated from the coating station and equipped with a plasma treater, the treater incorporating a device configured and operable for generating plasma in sufficient proximity to the substrate and to treat the substrate with the plasma at a second pressure, the second pressure being greater than the first pressure, the at least one treating station comprising; a magnetic device configured and operable for generating a magnetic field; at least one cylindrical electrode surrounding the magnetic device; a rotation device operable for rotating the electrode about a longitudinal axis of said electrode thereby in operation causing deposits on the electrode surface to be removed, wherein the plasma treater receives a gas that includes at least oxygen. ### Claim 2 (depends on 1) The apparatus according to claim 1, wherein the treating station is located upstream of the coating station and is configured and operable to perform a pre-treatment on the substrate. ### Claim 3 (depends on 2) The apparatus according to claim 2, further comprising a second treating station located downstream of the coating station, the second treating station configured and operable to perform a post-treatment on the substrate. ### Claim 4 (depends on 2) The apparatus according to claim 2, wherein the plasma treater further incorporates a second electrode, the second electrode being arranged to rotate about its longitudinal axis, the two electrodes arranged to simultaneously rotate. ### Claim 5 (depends on 4) The apparatus according to claim 4, wherein the two electrodes are configured to rotate in opposite directions. ### Claim 6 (depends on 1) The apparatus according to claim 1, further comprising a connector for connection to a power source, brushes for transmitting power from the power source to at least one electrode during the rotation of said electrode; and a box configured and operable for sealing the brushes in an environment with a third pressure, the third pressure being greater than the second. ### Claim 7 (depends on 4) The apparatus of claim 4, further comprising a body having a web that defines two cavities, wherein each electrode is disposed in a respective cavity. ### Claim 8 (depends on 1) The apparatus according to claim 1, wherein treating station is located downstream of said coating station and configured and operable to perform a post-treatment on said substrate. ### Claim 9 (depends on 6) The apparatus according to claim 6, wherein the two electrodes are configured to rotate in opposite directions. ### Claim 10 (depends on 1) The apparatus according to claim 1, wherein the plasma treater further incorporates a second electrode, the second electrode being arranged to rotate about its longitudinal axis, the two electrodes arranged to simultaneously rotate. ### Claim 11 (depends on 2) The apparatus according to claim 2, wherein the treating station is configured to remove moisture or other contaminants from the substrate. ### Claim 12 (depends on 8) The apparatus according to claim 8, wherein the treating station is configured to remove contaminant particles from the substrate. ### Claim 13 (depends on 1) The apparatus according to claim 1, wherein the coating station is configured and operable to coat a substrate with aluminium. ### Claim 14 (depends on 1) The apparatus according to claim 1, wherein the at least one cylindrical electrodes comprise aluminium, stainless steel, non-ferrous metals, ceramic, titanium, or polymer. ### Claim 15 (depends on 1) The apparatus according to claim 1, wherein the coating station is configured and operable to coat a substrate with aluminium and the at least one cylindrical electrode of the treater is made from aluminium. ### Claim 16 (depends on 1) The apparatus according to claim 1, wherein the coating station is configured and operable to coat a substrate by evaporation. ### Claim 17 (depends on 1) The apparatus according to claim 1, wherein the treating station comprises a body arranged to accommodate two cylindrical electrodes each in a respective cavity, the body further being arranged to receive a web or substrate such that in use the substrate web splits the body into the two electrode receiving cavities. ### Claim 18 (depends on 1) The apparatus according to claim 1, wherein the magnetic device is arranged to generate a magnetic field in a front side of the treating station through which in use the substrate web passes but not a rear side, the apparatus further comprising a body covering the rear side of the cylindrical electrode. ### Claim 19 A plasma treater adapted to plasma treat a substrate, the treater comprising a device configured and operable for generating plasma in sufficient proximity to the substrate for treating the substrate with the plasma, a magnetic device configured and operable for generating a magnetic field, at least one cylindrical electrode surrounding the magnetic device, a rotation device operable for rotating the electrode about a longitudinal axis of said electrode thereby in operation causing deposits on the electrode surface to be removed, the treater being arranged to be disposed in serial with a coating station adapted to coat the substrate at a coating pressure by evaporation, the treater being further arranged to be segregated from and have a separate pressure environment from the coating station such that in operation the treater is arranged to operate at a treating pressure, the treating pressure being higher than the coating pressure, and the treater receives a gas that includes at least oxygen. ### Claim 20 (depends on 19) The plasma treater according to claim 19, wherein the treater further incorporates a second electrode, the second electrode being arranged to rotate about its longitudinal axis, the two electrodes arranged to simultaneously rotate. ### Claim 21 (depends on 20) The plasma treater according to claim 20, wherein the two electrodes are configured to rotate in opposite directions. ### Claim 22 (depends on 19) The plasma treater according to claim 19, wherein the at least one cylindrical electrode comprises aluminium, stainless steel, non-ferrous metals, ceramic, titanium, or polymer. ### Claim 23 (depends on 20) The plasma treater according to claim 20, further comprising a body arranged to accommodate two cylindrical electrodes each in a respective cavity, the body further being arranged to receive a web or substrate such that in use the substrate web splits the body into the two electrode receiving cavities. ### Claim 24 (depends on 19) The plasma treater according to claim 19, wherein the magnetic device is arranged to generate a magnetic field in a front side of the treater through which in use a substrate web passes but not a rear side, the treater further comprising a body covering the rear side of the cylindrical electrode. ### Claim 25 (depends on 19) The plasma treater according to claim 19, further comprising a connector for connection to a power source, brushes for transmitting power from the power source to at least one electrode during the rotation of said electrode; and a box configured and operable for sealing the brushes in an environment with a third pressure, the third pressure being greater than the second pressure. ### Claim 26 (depends on 1) The apparatus according to claim 1, further comprising a second treating station that includes only one post-treater located downstream of the coating station, the second coating station being configured and operable to perform a post-treatment on the substrate. ### Claim 27 An apparatus for coating a substrate with a material in a chamber subject, during use, to substantial evacuation, the apparatus comprising: a coating station within said chamber configured and operable for coating a substrate by evaporation at a first pressure; at least one treating station disposed in series with and segregated from the coating station and equipped with a plasma treater, the treater incorporating a device configured and operable for generating plasma in sufficient proximity to the substrate and to treat the substrate with the plasma at a second pressure, the second pressure being greater than the first pressure, the at least one treating station comprising; a magnetic device configured and operable for generating a magnetic field; at least one cylindrical electrode surrounding the magnetic device; a rotation device operable for rotating the electrode about a longitudinal axis of said electrode thereby in operation causing deposits on the electrode surface to be removed, wherein the treating station includes only one pre-treater located upstream of the coating station and is configured and operable to perform a pre-treatment on the substrate. ### Claim 28 (depends on 27) The apparatus according to claim 27, further comprising a second treating station that includes only one post-treater located downstream of the coating station, the second coating station being configured and operable to perform a post-treatment on the substrate.