# US 9,751,189 B2 · Compliant polishing pad and polishing module > Agents: this data is available as JSON from the patentgrep API and MCP server — see https://patentgrep.com/llms.txt - Number: US 9,751,189 B2 - Document ID: US9751189B2 - Status: Granted - Kind: B2 - Application number: 14/476,991 - Filed: 2014-09-04 - Published: 2016-01-07 - Granted: 2017-09-05 - Earliest claimed: 2014-07-03 - Assignees: Applied Materials, Inc. - Applicants: Applied Materials, Inc. - Inventors: Chih Hung Chen; Jay Gurusamy; Steven M. Zuniga - Web page: https://patentgrep.com/patent/US9751189B2 ## CPC - B24B 41/047: Grinding heads for working on plane surfaces - B24B 37/10: for single side lapping - B24B: MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING (grinding of gear teeth B23F, of screw-threads B23G1/36; by electro-erosion B23H; abrasive or related blasting B24C; tools for grinding, buffing or sharpening B24D; polishing compositions C09G1/00; abrasives C09K3/14; electrolytic etching or polishing C25F3/00; grinding arrangements for use on assembled railway tracks E01B31/17); DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS ## Abstract A polishing device includes a housing, a flexible base coupled to the housing, and a contact region disposed on a first side of the flexible base, wherein the flexible base expands and contracts based on pressure contained within the housing and a second side of the flexible base to form a contact area on the first side that is less than a surface area of the flexible base. ## Claims ### Claim 1 A polishing device, comprising: a support arm extending in a first direction over a circular chuck from a perimeter of the chuck; a movement mechanism coupled to the support arm; a housing fixed to the support arm in a second direction that is orthogonal to the first direction; a flexible base coupled to the housing; and a contact region disposed on a first side of the flexible base and protruding from the flexible base, the contact region being shaped in an arc having a radius that has a center that is substantially positioned along an axis of rotation of the circular chuck when the support arm is disposed over the circular chuck, wherein the flexible base expands and contracts based on pressure contained within the housing and a second side of the flexible base to form a contact area on the first side that is less than a surface area of the flexible base. ### Claim 2 (depends on 1) The device of claim 1, wherein the contact region is positioned on the base along an arc segment. ### Claim 3 (depends on 1) The device of claim 1, wherein the contact region comprises a plurality of contact pads. ### Claim 4 (depends on 1) The device of claim 1, wherein the flexible base comprises a raised lip at a perimeter thereof. ### Claim 5 (depends on 1) The device of claim 1, wherein the contact area is adjustable. ### Claim 6 (depends on 5) The device of claim 5, wherein the adjustment of the contact area is based on a process recipe. ### Claim 7 (depends on 1) The device of claim 1, wherein the contact region is arc-shaped. ### Claim 8 (depends on 1) The device of claim 1, wherein the contact region is circular. ### Claim 9 A polishing module, comprising: a rotatable chuck having a substrate receiving surface and a perimeter; a support arm extending in a first direction over the perimeter of the chuck that is movable relative to the chuck; a housing fixed to the support arm in a second direction that is orthogonal to the first direction; and a polishing pad disposed on the housing, the polishing pad comprising a contact region positioned about a center of a flexible base and protruding from the flexible base, the contact region disposed in an arc that is at least concentric with the perimeter of the chuck, wherein the polishing pad is inflatable by pressure application to a backside of the flexible base. ### Claim 10 (depends on 9) The module of claim 9, wherein the contact region is detachably coupled to the flexible base. ### Claim 11 (depends on 9) The module of claim 9, wherein the contact region is arc-shaped. ### Claim 12 (depends on 9) The module of claim 9, wherein the contact region is circular. ### Claim 13 A method of polishing a substrate, comprising: providing a support arm positioned about a perimeter of a chuck that is linearly movable relative to the chuck; urging a polishing pad disposed on the support arm positioned in a cantilevered orientation over the chuck against a surface of a substrate positioned on the chuck, the polishing pad being disposed on a flexible base and being shaped in an arc that is concentric with an edge of the substrate; and adjusting a contact area of the polishing pad by adjusting a pressure to a backside of the flexible base, wherein the contact area is less than a surface area of the flexible base and protrudes from the flexible base. ### Claim 14 (depends on 13) The method of claim 13, wherein the adjusting of the contact area is based on a process recipe. ### Claim 15 (depends on 14) The method of claim 14, wherein the contact area conforms to the surface of the substrate. ### Claim 16 (depends on 13) The method of claim 13, wherein the contact area is arc-shaped. ### Claim 17 (depends on 16) The method of claim 16, wherein the contact area conforms to the surface of the substrate. ### Claim 18 (depends on 13) The method of claim 13, wherein the contact area is circular. ### Claim 19 (depends on 18) The method of claim 18, wherein the contact area conforms to the surface of the substrate.