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US 9,751,154 B2Granted
Transparent material processing with an ultrashort pulse laser
AssigneeImra America, Inc.
InventorsJames Bovatsek, Alan Y. Arai, Fumiyo Yoshino
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AssigneeImra America, Inc.
InventorsJames Bovatsek, Alan Y. Arai, Fumiyo Yoshino
Estimating the term…
Methods for ultrashort pulse laser processing of optically transparent materials. A method for scribing transparent materials uses ultrashort laser pulses to create multiple scribe features with a single pass of the laser beam across the material, with at least one of the scribe features being formed below the surface of the material. This enables clean breaking of transparent materials at a higher speed than conventional techniques. Slightly modifying the ultrashort pulse laser processing conditions produces sub-surface marks. When properly arranged, these marks are clearly visible with side-illumination and not clearly visible without side-illumination. In addition, a method for welding transparent materials uses ultrashort laser pulses to create a bond through localized heating. The ultrashort pulse duration causes nonlinear absorption of the laser radiation, and the high repetition rate of the laser causes pulse-to-pulse accumulation of heat within the materials. The laser is focused near the interface of the materials, generating a high energy fluence at the region to be welded. This minimizes damage to the rest of the material and enables fine weld lines.
A laser-based method for generating visible patterns of optical defects comprising marks formed below the surface of a transparent material, said patterns having controllable contrast and visibility, said method comprising:
A laser-based system for generating visible patterns of optical defects comprising marks below the surface of a transparent material, said patterns having controllable contrast and visibility, said system comprising:
A transparent device having internal marks at different depths, at least a portion of said marks being arranged as continuous extended lines, with an elongated cross-sectional profile, in such a way as to prevent shadowing in which a first mark closer to a directional illumination source prevents the directional illumination from impinging upon a second mark, and wherein said marks are sufficiently small and smooth to decrease visibility under ambient light while increasing pattern resolution.
Dependencies are inferred from the claim text.