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US 9,744,745 B2Granted
Circuit substrate and manufacturing method thereof
AssigneeShengyi Technology Co., Ltd.
InventorsMinshe Su, Qianfa Liu
Life of this patent
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AssigneeShengyi Technology Co., Ltd.
InventorsMinshe Su, Qianfa Liu
Estimating the term…
Provided is a circuit substrate, including a glass film (10) forming a rough layer (11) after surface roughness processing, a resin adhesion (20) located the rough layer (11) on either side of the glass film (10), and a metal foil (30) located on the outside of resin adhesion layer (20). The glass film (10), the resin adhesion layer (20) and the metal foil (30) are joined together through suppressing. The circuit substrate employs the glass film (10) which forms a rough layer (11) after surface roughness processing as a carrier material, so that the resin adhesion layer (20) and the surface of the glass film (10) have a good binding force, and the dielectric constant of the circuit substrate has slight difference in the directions of X, Y and Z. Also provided is manufacturing method for a circuit substrate.
A circuit substrate, comprising a glass film with roughened layers on both sides formed by a surface roughening treatment, resin adhesion layers located on each of the roughened layers, and metal foils located outside of the resin adhesion layers, wherein the glass film, the resin adhesion layers and the metal foils are combined by pressing, and wherein the thickness of each of the roughened layers is from 5 μm to 20 μm and the sum of the thickness of the roughened layers of both sides of the glass film is not over ½ of the thickness of the glass film.
A circuit substrate, comprising:
Dependencies are inferred from the claim text.