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US 9,741,924 B2Granted
Magnetic sensor having a recessed die pad
AssigneeSii Semiconductor Corporation
InventorsTakaaki Hioka, Mika Ebihara
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Abstract
A magnetic sensor has a pair of Hall elements formed in spaced-apart relationship on a front surface of a semiconductor substrate. A die pad is bonded to a back surface of the semiconductor substrate and overlaps the Hall elements. The die pad has formed therein a magnetic converging plate holder having a recessed portion, and a magnetic converging plate having the same shape and size as the recessed portion is fitted in the recessed portion of the magnetic converging plate holder.
Claims5
A magnetic sensor, comprising:
- a semiconductor substrate;
- a pair of Hall elements formed on a surface of the semiconductor substrate so as to be separated from each other by a separation region;
- a protective film formed on the semiconductor substrate so as to cover the pair of Hall elements;
- a die pad bonded to a back surface of the semiconductor substrate so as to overlap the separation region and each of the Hall elements of the pair of Hall elements, the die pad having a magnetic converging plate holder having a recessed portion between the die pad and the back surface;
- and
- a magnetic converging plate having the same shape as, and fitted in, the recessed portion of the magnetic converging plate holder.
3 more elements
Dependencies are inferred from the claim text.