Thermal management systems and methods for wafer processing systems
AssigneeApplied Materials, Inc.
InventorsDavid Benjaminson, Dmitry Lubomirsky
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AssigneeApplied Materials, Inc.
InventorsDavid Benjaminson, Dmitry Lubomirsky
Estimating the term…
A workpiece holder includes a puck having a cylindrical axis, a radius about the cylindrical axis, and a thickness. At least a top surface of the puck is substantially planar, and the puck defines one or more thermal breaks. Each thermal break is a radial recess that intersects at least one of the top surface and a bottom surface of the cylindrical puck. The radial recess has a thermal break depth that extends through at least half of the puck thickness, and a thermal break radius that is at least one-half of the puck radius. A method of processing a wafer includes processing the wafer with a first process that provides a first center-to-edge process variation, and subsequently, processing the wafer with a second process that provides a second center-to-edge process variation that substantially compensates for the first center-to-edge process variation.
A workpiece holder that positions a workpiece for processing, the workpiece holder comprising:
A workpiece holder that positions a workpiece for processing, the workpiece holder comprising:
A workpiece holder that positions a workpiece for processing, the workpiece holder comprising:
A workpiece holder that positions a workpiece for processing, the workpiece holder comprising:
Dependencies are inferred from the claim text.