# US 9,739,600 B1 · Chromatic confocal device and method for 2D/3D inspection of an object such as a wafer

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- Number: US 9,739,600 B1
- Document ID: US9739600B1
- Status: Granted
- Kind: B1
- Application number: 15/184,034
- Filed: 2016-06-16
- Granted: 2017-08-22
- Earliest claimed: 2016-03-25
- Assignees: Unity Semiconductor Corporation
- Applicants: Fogale Nanotech
- Inventors: Gilles Fresquet; Alain Courteville; Philippe Gastaldo
- Web page: https://patentgrep.com/patent/US9739600B1

## CPC

- G01J 3/0208: {using focussing or collimating elements, e.g. lenses or mirrors; performing aberration correction}
- G01B 11/022: {by means of tv-camera scanning}
- G01B 11/0608: {Height gauges}
- G01B 11/22: for measuring depth
- G01B 11/245: using a plurality of fixed, simultaneously operating transducers ({G01B11/2408 - G01B11/2425, } G01B11/255 take precedence)
- G01J 3/0218: {using optical fibers}
- G01J 3/18: using diffraction elements, e.g. grating (gratings per se G02B)
- G01J 3/453: by correlation of the amplitudes
- G01N 21/8806: {Specially adapted optical and illumination features}
- G01N 21/8851: {Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges (G01N21/8806 and G01N21/93 - G01N21/95692 take precedence; optical measurement of dimensions G01B11/00; optical scanning G02B26/10; image transformation G06T3/00; computerised image enhancement G06T5/00; image processing per se for flaw detection G06T7/0002)}
- G01N 21/9501: {Semiconductor wafers (manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)}
- G01N 21/956: Inspecting patterns on the surface of objects {(contactless testing of electronic circuits G01R31/308; testing currency G07D; manufacturing processes per se of semiconductor devices implementing a measuring step H10P74/20)}
- G02B 21/0064: {multi-spectral or wavelength-selective arrangements, e.g. wavelength fan-out, chromatic profiling (G02B21/0076 takes precedence)}
- H10P 74/203: {Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects}
- G01B 2210/50: Using chromatic effects to achieve wavelength-dependent depth resolution
- G01B 2210/56: Measuring geometric parameters of semiconductor structures, e.g. profile, critical dimensions or trench depth
- G01N 2201/063: Illuminating optical parts
- G01N 2201/0833: Fibre array at detector, resolving
- G01N 2201/105: Purely optical scan
- G01J: MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY (light sources F21, H01J, H01K, H05B; investigating properties of materials by optical means G01N)
- G01B: MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01N: INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES (measuring or testing apparatus or processes other than immunoassay, involving enzymes or microorganisms C12M, C12Q)
- G02B: OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- H10P: GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10

## Abstract

A confocal chromatic device for inspecting the surface of an object such as a wafer, including a plurality of optical measurement channels with collection apertures arranged for collecting the light reflected by the object through a chromatic lens at a plurality of measurement points, the plurality of optical measurement channels including optical measurement channels with an intensity detector for measuring a total intensity of the collected light. A method is also provided for inspecting the surface of an object such as a wafer including tridimensional structures.

## Claims

### Claim 1

A confocal chromatic device for inspecting the surface of an object, comprising:
a chromatic lens with an extended axial chromatism;
a light source for illuminating the object through the chromatic lens with a plurality of optical wavelengths being focused at different axial distances;
a plurality of optical measurement channels with collection apertures arranged for collecting the light reflected by the object through the chromatic lens at a plurality of measurement points; and
the plurality of optical measurement channels comprise optical measurement channels with an intensity detector for measuring a total intensity of the collected light at a measurement point, and provide, by scanning the surface of the object, an intensity 2D image information of the surface,
said intensity detector being implemented so as to image the surface of said object with a high lateral resolution over an extended depth of focus.

### Claim 2 (depends on 1)

The device of claim 1, wherein the plurality of optical measurement channels further comprises at least one optical measurement channel with a spectral detector for measuring a spectral information of the collected light and deducing an axial distance information.

### Claim 3 (depends on 2)

The device of claim 2, which comprises at least one optical routing element allowing doing at least one of the following:
using an intensity detector and a spectral detector to do measurements simultaneously or sequentially on one optical measurement channel; and
selectively using an intensity detector and/or a spectral detector with a plurality of optical measurement channels.

### Claim 4 (depends on 2)

The device of claim 2, which comprises collection apertures respectively arranged along a first line and a second line substantially parallel to the first line, the first line comprising collection apertures of optical measurement channels with an intensity detector, the second line comprising collection apertures of optical measurement channels with a spectral detector.

### Claim 5 (depends on 1)

The device of claim 1, wherein the optical measurement channels comprise collection optical fibers, an end of which being used as collection apertures.

### Claim 6 (depends on 1)

The device of claim 1, further including a magnifying lens positioned between the collection apertures and the chromatic lens, and arranged for introducing a variable or changeable scaling factor between the spatial repartition of the collection apertures and the measurement points.

### Claim 7 (depends on 6)

The device of claim 6, which comprises a magnifying lens of a zoom type allowing introducing a variable magnification.

### Claim 8 (depends on 6)

The device of claim 6, which further comprises a mechanical mount allowing changing at least one of the following:
a magnifying lens,
a combination of magnifying lens and chromatic lens.

### Claim 9 (depends on 1)

The device of claim 1, further comprising collection apertures arranged along a line.

### Claim 10 (depends on 1)

The device of claim 1, further comprising mechanical displacement stages for moving relatively the object and the chromatic lens.

### Claim 11

A method for inspecting the surface of an object comprising tridimensional structures, the method comprising:
providing a chromatic lens with an extended axial chromatism;
illuminating the object through the chromatic lens with a plurality of optical wavelengths being focused at different axial distances;
collecting the light reflected by the object through the chromatic lens at a plurality of measurement points using a plurality of optical measurement channels with collection apertures; and
measuring a total intensity of the light collected by at least one of the optical measurement channels for obtaining an intensity information at a measurement point; and
providing, by scanning the surface of the object with an intensity detector, an intensity 2D image information of the surface, said intensity detector being implemented so as to image the surface of said object with a high lateral resolution over an extended depth of focus.

### Claim 12 (depends on 11)

The method of claim 11, further comprising a step of measuring a spectral information of the light collected by at least one of the optical measurements channels for obtaining an axial distance information.

### Claim 13 (depends on 12)

The method of claim 12, further comprising steps of:
obtaining an intensity information at a plurality of measurement points on the object;
identifying at least one measurement point of interest using said intensity information;
obtaining an axial distance information at said at least one point of interest.

### Claim 14 (depends on 13)

The method of claim 13, further comprising a step of moving relatively the object and the chromatic lens to position at least one optical measurement channel so as to obtain at least one axial distance information on a previously identified measurement point of interest.

### Claim 15 (depends on 13)

The method of claim 13, comprising a step of moving relatively the object and the chromatic lens along a pre-defined scan trajectory, and for at least one scan position:
obtaining at least one intensity information; and/or
obtaining at least one axial distance information on a measurement point of interest previously identified.

### Claim 16 (depends on 12)

The method of claim 12, further comprising steps of:
locating at least one structure on the surface of the object using intensity information; and
identifying at least one measurement point of interest relative to said structure.

### Claim 17 (depends on 12)

The method of claim 12, further comprising steps of:
building an intensity image by combining intensity information obtained in a region of interest of the object; and/or
building a height map by combining axial distance information obtained in a region of interest of the object.

### Claim 18 (depends on 12)

The method of claim 12, further comprising a step of comparing obtained axial distance information with reference value(s).

### Claim 19 (depends on 12)

The method of claim 12, which is implemented for inspecting bump structures on a wafer.

### Claim 20 (depends on 19)

The method of claim 19, comprising steps of:
locating at least one bump structure on the surface of the object using intensity information;
locating at least one point of interest corresponding to the summit of the bump structure; and
obtaining axial distance information at said at least one point of interest, and deducing a height information of said bump structure.

### Claim 21 (depends on 11)

The method of claim 11, further comprising at least one of the following steps:
adjusting a spatial repartition of the measurement points taking into account a spatial repartition of structures on the object;
adjusting a spacing of measurements points as to substantially match a spacing of structures on the object; and
changing a scaling factor between a spatial repartition of the collection apertures and the measurement points using a magnifying lens.