Receiving device and shield case connection method
AssigneePanasonic Intellectual Property Management Co., Ltd.
InventorsIsao Ueda, Toshitaka Suma, Akio Takeuchi
Life of this patent
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Abstract
A receiving device includes a shield case which is in a hollow box shape that is open on one side. The shield case reduces external interfering signals which interfere with an input signal of a broadcast wave. A printed wiring board includes a conductive portion that is electrically connected with an electronic component. A soldered portion is formed along a protrusion-free linearly extending side of an opening edge of the shield case. The soldered portion electrically connects with solder the shield case and the conductive portion.
Claims13
A receiving device comprising:
- a shield case which is in a hollow box shape that is open on one side, the shield case reducing external interfering signals which interfere with an input signal of a broadcast wave;
- and
- a printed wiring board including a conductive portion that is electrically connected with an electronic component,
- wherein
- a soldered portion is formed along a protrusion-free linearly extending side of an opening edge of the shield case, the soldered portion electrically connecting with solder the shield case and the conductive portion of the printed wiring board,
- the shield case includes an input connector,
- the printed wiring board includes a core wire connection portion to be connected with a core wire included in the input connector, and a front resist layer over the conductive portion on a front surface of the printed wiring board,
- the soldered portion is provided for, from among sides of the opening edge of the shield case, a side that is disposed closest to the core wire connection portion, and
- the receiving device further comprises a front slit formed in the front resist layer in a position inside the shield case, the front slit dividing a portion of the conductive portion that is disposed near the core wire connection portion, the front slit being formed by boring only the front resist layer and blocks electrical conduction, and the front slit having a lower permittivity compared to the front resist layer.
Dependencies are inferred from the claim text.