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US 9,717,148 B2Granted
Methods of forming a microelectronic device structure, and related microelectronic device structures and microelectronic devices
AssigneeQuartzdyne, Inc.
InventorMark Hahn
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Abstract
A method of forming a microelectronic device structure comprises coiling a portion of a wire up and around at least one sidewall of a structure protruding from a substrate. At least one interface between an upper region of the structure and an upper region of the coiled portion of the wire is welded to form a fused region between the structure and the wire.
Claims8
A microelectronic device structure, comprising:
- a structure protruding from a surface of another structure, and comprising:
- a proximal region adjacent an interface between the structure and the surface of the another structure;
- and
- a distal region opposing the proximal region;
- a wire coiled around at least one sidewall of the structure;
- and
- a fused region integral and continuous with the distal region of the structure and a terminal end of the wire.
4 more elements
A microelectronic device, comprising:
- a microelectronic device structure comprising:
- at least one structure longitudinally projecting from a surface of another structure;
- and
- at least one wire coupled to the at least one structure, a portion of the at least one wire coiled up and around the at least one structure and attached to the at least one structure through at least one fused region integral and continuous with the at least one structure and the at least one wire.
1 more element
Dependencies are inferred from the claim text.