US 9,705,059 B2Granted

Light emitting package having a guiding member guiding an optical member

AssigneeLG Innotek Co., Ltd.

InventorJun Seok Park

Life of this patent

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Abstract

A light emitting device package including a base including a top flat surface; an insulating layer on the base; a light emitting diode on the base; an optical member comprising a light transmissive material such that light emitted from the light emitting diode passes therethrough; a guiding member to guide the optical member, the guiding member having a ring shape; an electrical circuit layer electrically connected to the light emitting diode, the electrical circuit layer including an electrode portion and an extended portion, the electrode portion disposed inside the guiding member and electrically connected to the light emitting diode, the extended portion extended from the electrode portion to outside the guiding member; and an electrode layer on the electrode portion of the electrical circuit layer and electrically connected to the light emitting diode.

Claims22

Dependent claims

A light emitting device package, comprising:

a base including a top flat surface;
an insulating layer on the base;
a light emitting diode on a region of the top flat surface of the base, wherein the region is an area where the insulating layer is not disposed on the base;
an optical member comprising a light transmissive material such that light emitted from the light emitting diode passes therethrough;
a guiding member to guide the optical member, the guiding member having a ring shape and surrounding the region of the base;
a first electrical circuit layer disposed on the insulating layer and including a first portion disposed between a top surface of the insulating layer and a first portion of a bottom surface of the guiding member;
and
a second electrical circuit layer disposed on the insulating layer and including a second portion disposed between the top surface of the insulation layer and a second portion of the bottom surface of the guiding member,
wherein the first electrical circuit layer includes a first extension portion and a second extension portion, the first extension portion extends from the first portion of the first electrical circuit layer beyond an outside edge of the guiding member in a first direction, and the second extension portion extends from an end of the first extension portion in a second direction,
wherein the second electrical circuit layer includes a third extension portion and a fourth extension portion, the third extension portion extends from the second portion of the second electrical circuit layer beyond an outside edge of the guiding member in a third direction, and the fourth extension portion extends from an end of the third extension portion in a fourth direction, and
wherein the first direction and the third direction are antiparallel each other.

8 more elements

A light emitting device package, comprising:

a base having a flat top surface;
an insulating layer on the base;
a light emitting diode on a region of the flat top surface of the base, wherein the region is an area where the insulating layer is not disposed on the base, and the insulating layer surrounds the region of the base;
an optical member comprising a light transmissive material such that light emitted from the light emitting diode passes therethrough;
a guiding member to guide the optical member, the guiding member having a ring shape and surrounding the region of the base;
a first electrical circuit layer disposed on the insulating layer and including a first portion disposed between a top surface of the insulating layer and a first portion of a bottom surface of the guiding member;
and
a second electrical circuit layer disposed on the insulating layer and including a second portion disposed between the top surface of the insulation layer and a second portion of the bottom surface of the guiding member,
wherein the first electrical circuit layer includes a first extension portion extended from the first portion of the first electrical circuit layer beyond an outside edge of the guiding member in a first direction,
wherein the second electrical circuit layer includes a second extension portion extended from the second portion of the second electrical circuit layer beyond an outside edge of the guiding member in a second direction,
wherein the first direction and the second direction are antiparallel each other,
wherein the first electrical circuit layer and the second electrical circuit layer are not disposed on the region of the base,
wherein the bottom surface of the guiding member is disposed higher than a bottom surface of the optical member, and
wherein the base includes a fastening hole.

11 more elements

Dependencies are inferred from the claim text.

Facts

Application: 15/156,030Filed 16 May 2016 · continuation
Priority: KR 10-2004-010778217 Dec 2004
Published: US 2016/0104826 A18 Sep 2016
Granted: 11 Jul 2017
Term ends: Not estimatedThe source records don’t support an estimate.

Classification27 codes

H10H 20/8581
Means for heat extraction or cooling: characterised by their material
H05K 1/0203
Thermal arrangements, e.g. for cooling, heating or preventing overheating: cooling of mounted components
H05K 1/021
Cooling of mounted components: components thermally connected to metal substrates or heat-sinks by insert mounting
H10H 20/832
Electrodes: characterised by their material

Family

PCT/KR2005/002368Parent of this continuation · filed 21 Jul 2005
Application12/860,792Parent of this continuation · filed 20 Aug 2010
US 7,821,020 B2Parent of this continuation · filed 26 Oct 2010
Application13/036,947Parent of this continuation · filed 28 Feb 2011
US 7,977,684 B2Parent of this continuation · filed 12 Jul 2011
Application13/182,393Parent of this continuation · filed 13 Jul 2011
US 8,003,997 B2Parent of this continuation · filed 23 Aug 2011
Application13/399,709Parent of this continuation · filed 17 Feb 2012
US 8,138,507 B2Parent of this continuation · filed 20 Mar 2012
Application13/651,110Parent of this continuation · filed 12 Oct 2012
US 8,378,360 B2Parent of this continuation · filed 19 Feb 2013
Application13/892,814Parent of this continuation · filed 13 May 2013
US 8,445,922 B2Parent of this continuation · filed 21 May 2013
Application14/066,468Parent of this continuation · filed 29 Oct 2013
US 8,598,601 B2Parent of this continuation · filed 3 Dec 2013
Application14/507,560Parent of this continuation · filed 6 Oct 2014
US 8,878,200 B2Parent of this continuation · filed 4 Nov 2014
Application14/975,030Parent of this continuation · filed 18 Dec 2015
US 9,240,534 B2Parent of this continuation · filed 19 Jan 2016
US 2016/0260879 A1Pre-grant publication · published 8 Sep 2016
US 9,362,469 B2Parent of this continuation
Application10/578,150Parent of this continuation
US 2008/0290352 A1Published application
US 2010/0314652 A1Published application
US 2011/0147781 A1Published application
US 2011/0266583 A1Published application
US 2012/0146082 A1Published application
US 2013/0032844 A1Published application
US 2013/0240941 A1Published application
US 2014/0054622 A1Published application
US 2015/0021645 A1Published application
US 2016/0104826 A1Published application
US 9,705,059 B2This patent

From the US filing history. Foreign family members aren’t listed.