Method for regenerating plating liquid, plating method, and plating apparatus
AssigneeFuji Shoji Co., Ltd.
InventorsTatsuya Banno, Katsuhiro Goto, Nobuhiro Kanazawa
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AssigneeFuji Shoji Co., Ltd.
InventorsTatsuya Banno, Katsuhiro Goto, Nobuhiro Kanazawa
Estimating the term…
A problem to be solved is to provide a method for regenerating plating liquid from plating waste liquid in a simple and easy way and a plating method utilizing the regenerating method. A method for regenerating plating liquid from plating waste liquid that is produced as a result of performing a copper plating on steel and that contains respective ions of Fe, Cu and Sn comprises repetitively performing processing steps of applying electric current with the plating waste liquid 11 side taken as a cathode 15 and electrolytic solution 12 side taken as an anode 16 in the state that the plating waste liquid 11 and the electrolytic solution 12 are connected through an anion exchange membrane 13; separating copper by making a copper deposition electrode as a result of depositing copper on the cathode 15 being in contact with the plating waste liquid 11, to turn the plating waste liquid to processed remaining liquid; and using as the anode 16 a copper deposition electrode formed previously and dissolving copper in the electrolytic solution 12 to generate copper ion-containing solution.
A method for plating a steel wire with plating liquid containing Cu ions, the method comprising:
The method of 3, further comprising, before the iron is removed from the processed remaining liquid, raising a pH by adding an oxygen-containing chemical compound comprising H2O2, O3 or H2O.
Dependencies are inferred from the claim text.