Integrated circuit combination of a target integrated circuit and a plurality of thin film photovoltaic cells connected thereto using a conductive path

A method of manufacturing an integrated circuit combined with a target integrated circuit (TIC), comprising:

• forming on at least one of a top surface and a bottom surface of the TIC a lower conductive layer (LCL) for a plurality of thin film photovoltaic (PV) cells;
• forming the plurality of thin film photovoltaic (PV) cells on a surface of the LCL that is distal to a substrate of the TIC;
• forming on each of the plurality of PV cells distal to the substrate an upper conducting layer (UCL);
• and
• forming a conductive path connecting at least a UCL of a first PV cell of the plurality of PV cells to at least a LCL of a second PV cell of the plurality of PV cells, wherein at least a first array of PV cells comprised of at least a first portion of the plurality of PV cells is connected by the respective UCL and LCL of each PV cell to provide a first voltage output.