Kneading apparatus and method for producing semiconductor encapsulating resin composition
AssigneeSumitomo Bakelite Co., Ltd.
InventorsShigehisa Ueda, Kazuo Noda
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AssigneeSumitomo Bakelite Co., Ltd.
InventorsShigehisa Ueda, Kazuo Noda
Estimating the term…
The kneading apparatus 1 includes a casing 2, a pair of elongated screws 4a, 4b rotatably provided in the casing 2. The screws 4a, 4b are arranged parallel and horizontally with respect to one another. The casing 2 has a main body 20 and a screw container 3 provided in the casing 2. The screw container 3 defines a kneading section 30 therein. The screw 4a includes a screw axis 41 having an outer periphery, a first screw member 42 provided on the outer periphery of the screw axis 41 and a kneading member 43 provided on the outer periphery of the screw axis 41. The first screw member 42 and kneading member 43 are provided in the kneading section 30. The screw 4a, the first screw member 42 and the kneading member 43 respectively have core portions 411, 412, 413 having a surface and outer layers 45 respectively provided on the surfaces of the core portions 411, 412, 413. The screw container 3 and the outer layers 45 are constituted of a nonmetallic material.
A kneading apparatus for kneading a composition containing plural kinds of pulverized materials, said apparatus comprising:
A kneading apparatus for kneading a composition containing plural kinds of pulverized materials, said apparatus comprising:
Dependencies are inferred from the claim text.