Method for creating through-connected vias and conductors on a substrate
AssigneeAbexl Inc.
InventorFred Koelling
Life of this patent
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Abstract
A method for creating electrically or thermally conductive vias in both vertical and horizontal orientations in a dielectric material has the steps of: (a) depositing a powder comprising metallic particles on a planar surface of a dielectric material having through or blind vias; (b) drying the deposited powder of metallic particles; (c) polishing the powder of metallic powders into the through or blind vias; (d) repeating steps (a)-(c) on a reverse side of the dielectric material; and (e) repeating steps (a)-(d) until no unfilled vias are detected.
Claims13
A method for creating electrically or thermally conductive vias in both vertical and horizontal orientations in a dielectric material, the method comprising the steps of:
- (a) depositing a dry powder comprising metallic particles on a planar surface of a dielectric material having through or blind vias;
- (b) polishing the powder of metallic particles into the through or blind vias;
- (d) applying a non-polar solvent to one or more planar surfaces of the dielectric material;
- (e) drying the deposited powder of metallic particles to further densify them;
- (f) repeating steps (a)-(e) on a reverse side of the dielectric material;
- and
- (g) repeating steps (a)-(f) until no unfilled vias are detected.
Dependencies are inferred from the claim text.