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AssigneeHisense Hiview Tech Co., Ltd.
InventorsDejun Wang, Wangjun Zhang, Haode Jiang
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A double-layer injection molding casing and a method for manufacturing the same, an electronic apparatus are provided by this invention, which adapts to an injection molding field and can solve the problems of a conventional double-layer injection molding casing such as complicated manufacturing process and low production efficiency. The double-layer injection molding casing of this invention includes an outer layer and an inner layer. A locating structure integrally formed with the inner layer is located at an inner surface of the inner layer. The method for manufacturing the double-layer injection molding casing includes: applying a multiple injection molding process, wherein the locating structure of the double-layer injection molding casing is integrally formed with the inner layer in the same injection molding step. The electronic apparatus of this invention includes the double-layer injection molding casing. The double-layer injection molding casing can be used as a casing of the electronic apparatus.
A double-layer injection molding casing comprising an outer layer and inner layer connected to each other, wherein
An electronic apparatus, comprising a double-layer injection molding casing, the double-layer injection molding casing comprising an inner layer and an outer layer connected to each other, wherein a locating structure integrally formed with the inner layer is located at an inner surface of the inner layer, and a ratio of an outer layer thickness and an inner layer thickness at a connecting portion of the outer layer and the inner layer is in a range from 0.85 to 1 for avoiding shrinking of an outer surface of the outer layer and facilitating demoulding of the locating structure, wherein the locating structure comprises a plurality of screw posts, and a ratio of a height and an outside diameter of at least one of the screw posts is either less than or equal to 3.
Dependencies are inferred from the claim text.