Metallic microneedles

A method for fabricating a microneedle, the method comprising:

• providing a mold pillar;
• forming an electrically-conductive polymer layer over the mold pillar wherein the electrically-conductive polymer layer comprises an apertured electrically-conductive polymer layer;
• depositing a metal layer over the electrically-conductive polymer layer to provide a microneedle;
• and
• forming the apertured electrically-conductive polymer layer by:
• applying a coating to a region of the mold pillar;
• and
• solvent-casting the electrically-conductive polymer layer onto the mold pillar using a solvent that is repelled by the coating so that the electrically-conductive polymer layer is created with an aperture located at the coated region.

A method for fabricating a microneedle, the method comprising:

• providing a mold pillar;
• forming an electrically-conductive polymer layer over the mold pillar wherein the electrically-conductive polymer layer comprises an apertured electrically-conductive polymer layer;
• depositing a metal layer over the electrically-conductive polymer layer to provide a microneedle;
• and
• forming the apertured electrically-conductive polymer layer by:
• orienting the mold pillar so that a first region of the mold pillar is vertically higher than a second region of the mold pillar;
• and
• solvent-casting the electrically-conductive polymer layer onto the mold pillar so that the force of gravity causes the electrically-conductive polymer layer to form with an aperture at the first region.

A method for fabricating a first microneedle and a second microneedle, the method comprising:

• providing a mold pillar;
• depositing a first metal layer over the mold pillar to provide a first microneedle;
• removing the first microneedle from the mold pillar;
• depositing a second metal layer over the mold pillar to provide a second microneedle;
• wherein depositing the first metal layer over the mold pillar to provide the first microneedle comprises:
• forming an electrically-conductive polymer layer over the mold pillar;
• and
• depositing the first metal layer over the electrically-conductive polymer layer;
• wherein depositing the first metal layer over the electrically-conductive polymer layer comprises:
• electroplating the first metal layer onto the electrically-conductive polymer layer and using the electrically-conductive polymer layer as an electrode in the electroplating process.

A method for fabricating an apertured microneedle, the method comprising:

• providing a mold pillar;
• forming an apertured electrically-conductive layer over the mold pillar;
• depositing a metal layer over the apertured electrically-conductive layer to provide an apertured microneedle;
• wherein forming the apertured electrically-conductive layer over the mold pillar comprises using a solvent-casting process;
• wherein the apertured electrically-conductive layer comprises an apertured electrically conductive polymer layer;
• and
• wherein depositing the metal layer over the apertured electrically-conductive layer comprises:
• electroplating the metal layer onto the apertured electrically-conductive polymer layer and using the apertured electrically-conductive polymer layer as an electrode in the electroplating process.