Power amplifier modules including wire bond pad and related systems, devices, and methods

A power amplifier module comprising:

• a power amplifier die on a substrate, the power amplifier die including a power amplifier configured to receive a radio frequency signal and to provide an amplified radio frequency signal;
• a conductive trace on the substrate, the conductive trace having a surface with a plated portion and an unplated portion, the unplated portion including an edge of the surface disposed between the plated portion and the power amplifier die;
• and
• a wire bond pad electrically connected to the power amplifier by a wire bond, the wire bond pad being disposed over the plated portion of the surface of the conductive trace, the wire bond pad including a nickel layer having a thickness that is less than 0.5 um, a palladium layer over the nickel layer, and a gold layer over the palladium layer.

A power amplifier module comprising:

• a power amplifier on a substrate and configured to provide a radio frequency signal,
• a conductive trace on the substrate, the conductive trace having a surface with a plated portion and an unplated portion, the conductive trace also having an unplated sidewall disposed between the power amplifier and the plated portion;
• and
• a wire bond pad electrically connected to an output of the power amplifier by a wire bond, the wire bond pad being disposed over the plated portion of the surface of the conductive trace, the wire bond pad including a diffusion barrier layer having a thickness sufficiently small such that the radio frequency signal is allowed to penetrate to the conductive trace, a barrier layer over the diffusion barrier layer, and a bonding layer over the barrier layer and bonded with the wire bond.