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US 9,660,364 B2Granted
System interconnect for integrated circuits
AssigneeIntel Corporation
InventorsTimothy Wig, Todd Hinck, Sanka Ganesan
Life of this patent
Estimating the term…
Abstract
An electronic device for transmitting data is described herein. In some examples, the electronic device includes a package substrate, and a plurality of integrated circuits to be coupled to the package substrate, at least one integrated circuit comprising a topside connector or an edge connector to be coupled to a cable that is to couple to a cable receptacle.
Claims15
An electronic device to transmit data comprising:
- a package substrate;
- and
- a plurality of integrated circuits coupled to the package substrate, at least one integrated circuit comprising a topside connector coupled to a cable receptacle via a first cable, the cable receptacle also coupled to a printed circuit board via a second cable separate from the first cable, the second cable receiving a sideband signal from the printed circuit board, wherein the at least one integrated circuit is connected to a backplane connector through the cable receptacle, and wherein a backplane package substrate enables data transmission between the at least one integrated circuit and a switch fabric silicon without a repeater.
An electronic device to transmit data comprising:
- an integrated circuit coupled to a package substrate, the integrated circuit having a topside connector coupled to a first cable;
- and
- a double-ended cable receptacle that is electrically coupled to the first cable from the topside connector and a second cable separate from the first cable that is electrically coupled to a chassis panel comprising a printed circuit board, the second cable receiving a sideband signal from the printed circuit board, wherein the integrated circuit is connected to a backplane connector through the double-ended cable receptacle, and wherein a backplane package substrate enables data transmission between the integrated circuit and a switch fabric silicon without a repeater.
A system to transmit data comprising:
- an integrated circuit coupled to a first package substrate, the integrated circuit to have a topside connector coupled to a first cable;
- a double-ended cable receptacle coupled to the first cable that is to transmit the data from the topside connector of the integrated circuit of the first package substrate to a chassis panel comprising a printed circuit board, the double-ended cable receptacle also coupled to a second cable separate from the first cable, the second cable receiving a sideband signal from the printed circuit board;
- and
- a backplane printed circuit board comprising a switch fabric silicon, wherein the integrated circuit is connected to a backplane connector through the double-ended cable receptacle, and wherein the backplane printed circuit board enables data transmission between the integrated circuit and the switch fabric silicon without a repeater.
1 more element
Dependencies are inferred from the claim text.