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US 9,659,832 B2Granted
Reactive hot-melt adhesive for use on electronics
AssigneeH.B. Fuller Company
InventorsAlbert M. Giorgini, Andrew Hilley
Life of this patent
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Abstract
The disclosure relates to a method of making an electronic assembly with a reactive hot-melt adhesive composition that include an atmospheric curing prepolymer and optionally a thermoplastic component with a softening point of at least about 120° C., and the electronic assembly made therewith.
Claims16
A method of making an electronic assembly comprising:
- applying a reactive hot melt adhesive composition comprising an atmospheric curing prepolymer and a first thermoplastic component, the first thermoplastic component having a Mettler softening point of less than 120° C. to at least a portion of a first substrate, the atmospheric curing prepolymer being an aliphatic isocyanate terminated polyurethane prepolymer that is a reaction product of an aliphatic polyisocyanate and a polyol at an NCO/OH ratio of from about 4.0:1.0 to about 4.0:1.5, and
- contacting the adhesive on the first substrate with at least a portion of a second substrate, at least one of the first and second substrates comprising at least one electronic component prior to applying the adhesive composition, the electronic component being disposed between the first substrate and the second substrate
- the first and second substrates being of the same or different material and being independently selected from the group consisting of polyethylene, polyethylene terephthalate, polyethylene naphthalate, and mixtures thereof.
An electronic assembly comprising:
- a first substrate;
- a second substrate;
- at least one electronic component located between the first and the second substrates;
- and
- a reactive hot melt adhesive comprising
- a reaction product of an atmospheric curing prepolymer and moisture, the atmospheric curing prepolymer being an aliphatic isocyanate terminated polyurethane prepolymer that is a reaction product of an aliphatic polyisocyanate and a polyol at an NCO/OH ratio of from about 4.0:1.0 to about 4.0:1.5, and
- a first thermoplastic component having a Mettler softening point of less than 120° C.,
- wherein at least a portion of the first substrate is bonded to at least a portion of the second substrate by the adhesive,
- the first and second substrates being of the same or different material and being independently selected from the group consisting of polyethylene, polyethylene terephthalate, polyethylene naphthalate, and mixtures thereof.
6 more elements
Dependencies are inferred from the claim text.