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US 9,657,200 B2Granted
Waterborne adhesives for reduced basis weight multilayer substrates and use thereof
AssigneeHenkel IP & Holding GmbH
InventorsTianjian Huang, Kristina Thompson, Daniel Waski, John Meccia
Life of this patent
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Abstract
The adhesive composition comprising emulsion polymers and microspheres and articles made therefrom are provided. The adhesive is particularly suitable for packages for consumer products that provide sufficient strength and thermal insulation while reducing the overall basis weight of the substrates.
Claims13
An article comprising a first substrate, a second substrate, and an adhesive interposed between the two substrates comprising:
- (a) an emulsion-based polymer selected from the group consisting of vinyl acetate ethylene dispersion, polyvinyl acetate, polyvinyl acetate polyvinyl alcohol, dextrin stabilized polyvinyl acetate, polyvinyl acetate copolymers, vinyl acetate-ethylene copolymers, styrene butyl rubber, polyurethane and mixtures thereof;
- (b) about a plurality of microspheres, wherein the microspheres have a volume of about 10 to about 40 V/V % in the adhesive;
- and
- (c) optionally, water, plasticizer, preservative;
- wherein the article has a substantially similar thermal insulation loss with about 26% decrease in substrate basis weight than an article without any microspheres;
- and
- wherein the article is a cup, food container, case, carton, bag, box, envelope, wrap or clamshell.
4 more elements
Dependencies are inferred from the claim text.