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US 9,657,154 B2Granted
Resin composition and uses of the same
AssigneeTaiwan Union Technology Corporation
InventorsShur-Fen Liu, Meng-Huei Chen, Hsin-Ho Wu
Life of this patent
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Abstract
A resin composition is provided. The resin composition includes a thermosetting resin component and a filler, wherein the thermosetting resin component has a dissipation factor (Df) of no more than 0.006 at 1 GHz, the filler is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C., and the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component.
Claims12
A resin composition, comprising:
- a thermosetting resin component, having a dissipation factor (Df) of no more than 0.006 at 1 GHz;
- and
- a filler, which is a ceramic powder obtained through a sintering process at a temperature ranging from 1300° C. to less than 1400° C.,
- wherein, the amount of the filler is 10 parts by weight to 600 parts by weight per 100 parts by weight of the thermosetting resin component, and
- wherein the ceramic powder is selected from the group consisting of titanium dioxide (TiO2), strontium titanate (SrTiO3), calcium titanate (CaTiO3), barium titanate (BaTiO3), magnesium titanate (MgTiO3), barium strontium titanate (Sr(Ba)TiO3), calcium strontium titanate (Sr(Ca)TiO3), NPO ceramic power, a co-sintered material of two or more of the foregoing compounds, and combinations thereof.
2 more elements
Dependencies are inferred from the claim text.