US 9,651,312 B2Granted

Flexible thermal ground plane and manufacturing the same

AssigneeKelvin Thermal Technologies, Inc.

InventorsRonggui Yang, Yung-Cheng Lee, Victor M. Bright, Chen Li, Christopher Oshman, Bo Shi, Jen- Hau Cheng, George P. Peterson

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Abstract

Methods, apparatuses, and systems are disclosed for flexible thermal ground planes. A flexible thermal ground plane may include a support member. The flexible thermal ground plane may include an evaporator region or multiple evaporator regions configured to couple with the support member. The flexible thermal ground plane may include a condenser region or multiple condenser regions configured to couple with the support member. The evaporator and condenser region may include a microwicking structure. The evaporator and condenser region may include a nanowicking structure coupled with the micro-wicking structure, where the nanowicking structure includes nanorods. The evaporator and condenser region may include a nanomesh coupled with the nanorods and/or the microwicking structure. Some embodiments may include a micromesh coupled with the nanorods and/or the microwicking structure.

Claims18

Dependent claims

A method for manufacturing a thermal ground plane, the method comprising:

providing a first planar substrate member, wherein the first planar substrate structure is flexible, and wherein the first planar substrate member comprises either or both a metal layer and a polymer layer;
disposing a liquid channel on the first planar substrate member using photolithography;
disposing a mesh structure on either or both the first planar substrate member and the liquid channel, wherein the mesh structure is flexible;
applying a coating to the mesh structure, wherein the coating creates corrosion protection for the mesh structure;
disposing a vapor core on at least one of the first planar substrate member, the liquid channel, and the mesh structure, such that the mesh structure separates the liquid channel from the vapor core;
disposing a second planar substrate member on the first planar substrate member such that the second planar substrate member and the first planar substrate member enclose the liquid channel, the mesh structure, and the vapor core, wherein the second planar substrate structure is flexible, and wherein the second planar substrate member comprises either or both a metal layer and a polymer layer;
sealing at least a portion of the first planar substrate member with a portion of the second planar substrate member;
charging the thermal ground plane with a working fluid via a fill tube;
and
sealing the fill tube, wherein the working fluid is fully enclosed within the thermal ground plane;
wherein the thermal ground plane has a thickness less than 1 mm.

8 more elements

A thermal ground plane comprising:

a first planar substrate member, wherein the first planar substrate member is flexible, and wherein the first planar substrate member comprises either or both a metal layer and a polymer layer;
a plurality of liquid channels disposed on the first planar substrate member using photolithography;
a mesh structure disposed on either or both the first planar substrate member and the plurality of liquid channels, wherein the mesh structure is flexible, and wherein the mesh structure includes a corrosion protection coating;
a vapor core disposed on at least one of the first planar substrate member, the plurality of liquid channels, and the mesh structure, wherein that the mesh structure separates the liquid channel from the vapor core;
and
a second planar substrate member disposed on the first planar substrate member such that the second planar substrate member and the first planar substrate member enclose the plurality of liquid channels, the mesh structure, and the vapor core, wherein the second planar substrate member is flexible, and wherein the second planar substrate member comprises either or both a metal layer and a polymer layer;
wherein at least a portion of the first planar substrate member is sealed with a portion of the second planar substrate member, and
wherein the thermal ground plane fully encloses a working fluid within the thermal ground plane;
wherein the thermal ground plane has a thickness less than 1 mm.

6 more elements

Dependencies are inferred from the claim text.

Facts

Application: 14/681,624Filed 8 Apr 2015 · continuation
Priority: 6 Mar 2009
Published: US 2015/0226493 A113 Aug 2015
Granted: 16 May 2017
Term ends: Not estimatedThe source records don’t support an estimate.

Classification14 codes

F28D 15/0241
In which the medium condenses and evaporates, e.g. heat pipes: the tubes being flexible
B23P 15/26
Making specific metal objects by operations not covered by a single other subclass or a group in this subclass: heat exchangers or the like
F28D 15/0233
In which the medium condenses and evaporates, e.g. heat pipes: the conduits having a particular shape, e.g. non-circular cross-section, annular
F28D 15/04
In which the medium condenses and evaporates, e.g. heat pipes: with tubes having a capillary structure

Family

Application61/158,086Us provisional application · filed 6 Mar 2009
Application12/719,775Parent of this continuation · filed 8 Mar 2010
US 2015/0226493 A1Pre-grant publication · published 13 Aug 2015
US 9,163,883 B2Parent of this continuation
US 2011/0017431 A1Published application
US 9,651,312 B2This patent

From the US filing history. Foreign family members aren’t listed.