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US 9,648,720 B2Granted
Method for manufacturing printed circuit boards
AssigneeSemblant Global Limited
InventorsFrank Ferdinandi, Rodney Edward Smith, Mark Robson Humphries
Life of this patent
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Abstract
A method including: attaching a plurality of conductive tracks to at least one surface of a substrate, depositing a coating comprising at least one halo-hydrocarbon polymer on the at least one surface of the substrate, and soldering through the coating.
Claims22
A method, comprising:
- attaching a plurality of conductive tracks to at least one surface of a substrate comprising an insulating material;
- depositing a coating on the at least one surface of the substrate, the coating covering at least a portion of the plurality of conductive tracks, the coating comprising at least one halo-hydrocarbon polymer;
- and
- after depositing the coating, soldering through the coating to form a solder joint between an electrical component and at least one conductive track attached to the substrate, the solder joint abutting the coating;
- and
- wherein:
- the coating is deposited as a substantially continuous layer on the at least one surface of the substrate;
- the solder joint is formed at a particular region of the substrate;
- and
- the soldering removes the coating from the particular region of the substrate without removing the coating from other regions of the substrate.
7 more elements
Dependencies are inferred from the claim text.