Film forming apparatus, gas supply device and film forming method
AssigneeTokyo Electron Limited
InventorsMasayuki Nasu, Masaki Sano, Yu Nunoshige
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AssigneeTokyo Electron Limited
InventorsMasayuki Nasu, Masaki Sano, Yu Nunoshige
Estimating the term…
There is provided a film forming apparatus including gas supply paths, retaining units, valves, a purge gas supply unit and a control unit. The control unit is configured to implements a film forming process for sequentially performing operations of actuating the valves such that reaction gases are retained in the retaining units, the internal pressures of the retaining units are increased and then the reaction gases are supplied from the retaining units into the process chamber, and a purging process for subsequently repeating, a plurality number of times, operations of actuating the valves such that the purge gas is retained in the retaining units, the internal pressures of the retaining units are increased to a pressure higher than the internal pressures of the retaining units which is increased in the film forming process, and then the purge gas is supplied from the retaining units into the process chamber.
A film forming apparatus for forming a thin film by sequentially supplying different kinds of mutually-reacting reaction gases to a substrate held within a process chamber of vacuum atmosphere and depositing reaction products on the substrate, the film forming apparatus comprising:
A gas supply device used in a film forming apparatus for forming a thin film by sequentially supplying different kinds of mutually-reacting reaction gases to a substrate held within a process chamber of vacuum atmosphere and depositing reaction products on the substrate, the gas supply device comprising:
Dependencies are inferred from the claim text.