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US 9,636,026 B2Granted
Multi-layered structure
AssigneeHeraeus Deutschland GmbH & Co. KG
InventorsJami A. Hafiz, Stefan Schibli, Jens Troetzschel
Life of this patent
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Abstract
One aspect relates to a layered structure with a substrate, a first layer over the substrate, and a second layer over the first layer. The substrate and the second layer are an electrically conductive material and the first layer is an insulating material or the substrate and the second layer are insulating material and the first layer is electrically conductive material. At least one of the first and second layers comprises an electrically conductive polymer.
Claims11
A layered structure comprising:
- a substrate;
- a first layer over the substrate;
- and
- a second layer over the first layer;
- characterized in that the substrate and the second layer are an electrically conductive material and the first layer is an insulating material or the substrate and the second layer are insulating material and the first layer is electrically conductive material, wherein at least one of the first and second layers comprises an electrically conductive polymer, and wherein each of the first and second layers are one tenth of the thickness of the substrate such that the layered structure substantially maintains the size and configuration of the substrate;
- wherein at least one of the first and second layers comprises electrically conductive Poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate);
- and
- wherein the substrate and the first and second layers are biocompatible such that the layered structure is configured for implantation into the human body.
5 more elements
A layered structure comprising:
- a conductive substrate;
- a first layer over the substrate, wherein the first layer comprises an insulating material and includes at least one access area;
- and
- a contact area at least partially within the access area and in conductive contact with the substrate;
- characterized in that the first layer has a thickness that is no more than one tenth of the thickness of the substrate such that the layered structure substantially maintains the size and configuration of the substrate and wherein the substrate, the first layer and the contact area are biocompatible such that layered structure is configured for implantation into the human body;
- and
- wherein the contact area is an electrically conductive Poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate) material;
- and
- wherein the access area is a hole in the first layer having a diameter of less than 0.4 mm.
6 more elements
A layered implanted medical device comprising:
- a substrate including
- a plurality of conductive layers and a plurality of insulating layers, at least some of the insulating layers insulating the conductive layers from each other;
- wherein at least one insulating layer includes at least one access area;
- and
- a face having a plurality of contact areas, each contact area in conductive contact with at least of the conductive layers via at least one access area;
- wherein each of the conducting and insulating layers have a thickness that is no more than one tenth of the thickness of the substrate such that the layered implanted medical device substantially maintains the size and configuration of the substrate and wherein each of the plurality of conducting layers, insulating layers, and the face are biocompatible;
- and
- wherein the contact area is an electrically conductive Poly(3,4-ethylenedioxythiophene) poly(styrenesulfonate) material.
5 more elements
Dependencies are inferred from the claim text.