RFID transponder chip modules
AssigneeFéinics AmaTech Teoranta
InventorsDavid Finn, Mustafa Lotya, Darren Molloy
Life of this patent
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Abstract
The planar antenna (PA) of a transponder chip module (TCM) may have a U-shaped portion so that an outer end (OE) of the antenna may be positioned close to an RFID chip (IC) disposed at a central area of a module tape (MT) for the transponder chip module. A module tape (MT2) may have contact pads (CP) on one side thereof and a connection bridge (CBR) on another side thereof, and may be joined with a module tape (MT1) having a planar antenna (PA). Metal of a conductive layer (CL) within a conductive element such as a coupling frame (CF) or a planar antenna (PA) may be scribed to have many small segments. A metal sheet may be stamped to have contact side metallization, and joined with a module tape (MT) having a planar antenna (PA).
Claims10
A transponder chip module (TCM) comprising:
- a first module tape (MT1) comprising a first substrate having two opposite top and bottom surfaces and having an antenna structure (AS) disposed on the bottom surface thereof;
- and
- a second module tape (MT2) comprising a second substrate having two opposite top and bottom surfaces and having contact pads (CP) disposed on the top surface thereof and a connection bridge (CBR) on the bottom surface thereof;
- wherein the second module tape (MT2) is joined to the first module tape (MT1);
- wherein the top of the first module tape (MT1) is joined to the bottom of the second module tape (MT2).
A method of making a transponder chip module (TCM) comprising:
- providing a first module tape (MT1) comprising a first substrate having two opposite top and bottom surfaces and having an antenna structure (AS) disposed on the bottom surface thereof;
- providing a second module tape (MT2) comprising a second substrate having two opposite top and bottom surfaces and having contact pads (CP) disposed on the top surface thereof and a connection bridge (CBR) on the bottom surface thereof;
- and
- joining the second module tape (MT2) to the first module tape (MT1);
- wherein the top of the first module tape (MT1) is joined to the bottom of the second module tape (MT2).
Dependencies are inferred from the claim text.