Thinning in package using separation structure as stop
AssigneeInfineon Technologies AG
InventorsManfred Engelhardt, Edward Fuergut, Hannes Eder
Life of this patent
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Abstract
A method of forming a thinned encapsulated chip structure, wherein the method comprises providing a separation structure arranged within an electronic chip, encapsulating part of the electronic chip by an encapsulating structure, and thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop.
Claims13
A method of forming a thinned encapsulated chip structure, the method comprising:
- forming a separation master structure arranged within a wafer;
- and
- singularising the wafer with its separation master structure into an electronic chip with its separation structure being formed by a portion of the separation master structure, and into at least one further electronic chip each having a further separation structure being formed by another portion of the separation master structure;
- encapsulating part of the electronic chip by an encapsulating structure;
- thinning selectively the electronic chip partially encapsulated by the encapsulating structure so that the encapsulating structure remains with a larger thickness than the thinned electronic chip, wherein the separation structure functions as a thinning stop.
A method of forming a thinned encapsulated semiconductor device, the method comprising:
- forming, on a wafer level, a separation layer being formed by a portion of a separation master structure within a semiconductor chip forming part of the wafer so that the separation layer separates a first chip body of the semiconductor chip on one side of the separation layer with regard to a second chip body of the semiconductor chip on the other side of the separation layer;
- forming, on the wafer level, at least one integrated circuit element in and/or on the first chip body;
- singularising the wafer with its separation master structure into the electronic chip with its separation structure being formed by a portion of the separation master structure, and into at least one further electronic chip each having a further separation structure being formed by another portion of the separation master structure;
- encapsulating part of the singularised chip by an encapsulating structure;
- removing selectively the second chip body up to the separation layer so that the encapsulating structure remains with a larger thickness than the first chip body.
Dependencies are inferred from the claim text.