Back to results
US 9,620,919 B2Granted
Process for producing shield layer-cut electric wire
AssigneeAsahi Seiki Co., Ltd.
InventorKanji Ishigure
Life of this patent
Estimating the term…
Abstract
A simplified process for producing a shield layer-cut electric wire that does not damage an insulating layer and a core wire and when cutting a shield layer.
Claims2
A process for producing a shield layer-cut electric wire from an electric wire having a shield layer and a coating layer applied to the outer periphery thereof, the process comprising,
- making a notch in the coating layer of the electric wire,
- separating the coating layer at the notch in an axial direction so that the shield layer is exposed;
- making the coating layers on both sides of the exposed shield layer approach each other, thereby applying force in the axial direction of the shield layer so that the shield layer becomes swollen in the radial direction of the electric wire;
- pushing down the swollen shield layer toward the outer face of the coating layer;
- and
- cutting the pushed-down shield layer on the outer face of the coating layer to produce the shield layer-cut electric wire.
3 more elements
Dependencies are inferred from the claim text.