Method of fabricating a micro device transfer head
AssigneeApple Inc.
InventorsAndreas Bibl, John A. Higginson, Hung-Fai Stephen Law, Hsin-Hua Hu
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Abstract
A micro device transfer head and head array are disclosed. In an embodiment, the micro device transfer head includes a base substrate, a mesa structure with sidewalls, an electrode formed over the mesa structure, and a dielectric layer covering the electrode. A voltage can be applied to the micro device transfer head and head array to pick up a micro device from a carrier substrate and release the micro device onto a receiving substrate.
Claims20
A method of fabricating an array of electrostatic transfer heads comprising:
- forming an array of mesa structures on a base substrate, each mesa structure including sidewalls;
- forming a passivation layer over the base substrate and the array of mesa structures, wherein forming the passivation over the base substrate and the array of mesa structures comprises a technique selected from the group consisting of conformal deposition of the passivation layer over the base substrate and the array of mesa structures and growing the passivation layer over the base substrate and the array of mesa structures;
- forming a separate electrode directly on the passivation layer and over each corresponding mesa structure such that each electrode is electrically insulated from each corresponding mesa structure;
- and
- depositing a dielectric layer over the array of mesa structures and each electrode.
A method of fabricating an array of electrostatic transfer heads comprising:
- forming an array of mesa structures on a base substrate, each mesa structure including sidewalls;
- forming a pair of electrodes over each corresponding mesa structure, wherein the electrodes in each pair of electrodes are electrically insulated from each other;
- and
- depositing a dielectric layer over the array of mesa structures and each electrode;
- wherein a top surface of the dielectric layer over each mesa structure corresponds to a contact surface for a corresponding electrostatic transfer head in the array of electrostatic transfer heads.
A method of fabricating an array of electrostatic transfer heads comprising:
- forming an array of mesa structures on a base substrate, each mesa structure including sidewalls;
- forming a separate electrode over each corresponding mesa structure;
- depositing a dielectric layer over the array of mesa structures and each electrode;
- and
- forming a conductive ground plane over the dielectric layer and surrounding each of the mesa structures, wherein the conductive ground plane includes an array of openings surrounding the array of mesa structures, and each mesa structure protrudes through a corresponding opening in the conductive ground plane.
Dependencies are inferred from the claim text.