Peeling device, peeling system, and peeling method

A peeling method of separating a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate, comprising:

• holding the superposed substrate by a holding unit;
• performing a position adjustment of the superposed substrate relative to the holding unit by making a plurality of position adjustment units contacted with a side surface of the superposed substrate held by the holding unit and making the superposed substrate move in a lateral direction;
• and
• separating the superposed substrate that is subjected to the position adjustment in the holding unit into the target substrate and the support substrate.

A peeling device configured to separate a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate, the peeling device comprising:

• a holding unit configured to hold the superposed substrate;
• and
• a plurality of position adjustment units movable toward and away from a side surface of the superposed substrate held in the holding unit, and the plurality of position adjustment units configured to perform a position adjustment of the superposed substrate relative to the holding unit by contacting the side surface of the superposed substrate,
• wherein each of the plurality of position adjustment units includes an arm unit which is an elongated member and a rotational movement mechanism configured to rotate the arm unit, and
• wherein the arm unit has a leading end and the leading end comes into contact with a side surface of the superposed wafer substrate when the arm unit is rotated by the rotational movement mechanism until the leading end is directed vertically and downwardly.

A peeling method of separating a superposed substrate, in which a target substrate and a support substrate are joined to each other with an adhesive, into the target substrate and the support substrate, comprising:

• holding the superposed substrate by a holding unit;
• performing a position adjustment of the superposed substrate relative to the holding unit by making a plurality of position adjustment units contacted with a side surface of the superposed substrate held by the holding unit;
• and
• separating the superposed substrate that is subjected to the position adjustment in the holding unit into the target substrate and the support substrate,
• wherein each of the plurality of position adjustment units includes an arm unit which is an elongated member and a rotational movement mechanism configured to rotate the arm unit, and
• wherein the arm unit has a leading end and the leading end comes into contact with a side surface of the superposed substrate when the arm unit is rotated by the rotational movement mechanism until the leading end is directed vertically and downwardly.