Multiple-cavity vapor cell structure for micro-fabricated atomic clocks, magnetometers, and other devices

A vapor cell, comprising:

• a first wafer;
• a second wafer positioned adjacent to the first wafer, the second wafer defining a first opening and a second opening independent of the first opening;
• and
• a third wafer arranged with the second wafer and the first wafer to enclose:
• a first cavity overlapping with the first opening;
• and
• a second cavity overlapping with the second opening and fluidly connected with the first cavity.

A system, comprising:

• a first wafer;
• a second wafer positioned adjacent to the first wafer, the second wafer defining a first opening and a second opening independent of the first opening;
• a third wafer arranged with the second wafer and the first wafer to enclose:
• a first cavity overlapping with the first opening;
• and
• a second cavity overlapping with the second opening and fluidly connected with the first cavity;
• and
• an illumination source configured to direct radiation to one of the first cavity or the second cavity.

A vapor cell, comprising:

• a first wafer;
• a second wafer positioned adjacent to the first wafer, the second wafer defining a first opening, a second opening independent of the first opening, and a third opening independent of the first opening and the second opening;
• a third wafer arranged with the second wafer and the first wafer to enclose:
• a first cavity overlapping with the first opening;
• a second cavity overlapping with the second opening and fluidly connected with the first cavity;
• and
• a third cavity overlapping with the third opening and fluidly connected with the second cavity;
• and
• a getter material deposited in the third cavity, the getter material configured to absorb a gas transferred to the second cavity.

A vapor cell, comprising:

• a first wafer;
• a second wafer positioned adjacent to the first wafer, the second wafer defining a first opening and a second opening independent of the first opening;
• a third wafer arranged with the second wafer and the first wafer to enclose:
• a first cavity overlapping with the first opening;
• and
• a second cavity overlapping with the second opening and fluidly connected with the first cavity;
• and
• a getter material deposited in the third cavity, the getter material configured to absorb a gas transferred to the second cavity.

A system, comprising:

• a first wafer;
• a second wafer positioned adjacent to the first wafer, the second wafer defining a first opening and a second opening independent of the first opening;
• a third wafer arranged with the second wafer and the first wafer to enclose:
• a first cavity overlapping with the first opening;
• and
• a second cavity overlapping with the second opening and fluidly connected with the first cavity;
• an illumination source configured to direct radiation to one of the first cavity or the second cavity;
• and
• a getter material deposited in a third cavity, the getter material configured to absorb a gas transferred to the second cavity.