High temperature stable thermally conductive materials
AssigneeDow Corning Corporation
InventorsDorab Bhagwagar, Kelly Messing, Elizabeth Wood
Life of this patent
Estimating the term…
Abstract
Disclosed herein are compositions, preparation methods, and use of thermally conductive materials comprising silicone composition curable by hydrosilylation, thermally conductive fillers, and phthalocyanine. The novel composition retains its desirable pliability after cure even when kept at an elevated temperature for an extended period.
Claims17
A composition comprising
- (A) an organoalkylpolysiloxane having in one molecule on average at least 0.1 silicon-bonded alkenyl groups;
- (B) a polyorganosiloxane having in one molecule on average at least 2 silicon-bonded hydrogen atoms, the molar ratio of SiH groups in the component (B) to aliphatically unsaturated organic group in the component (A) is 3:1 to 0.1 to 1;
- (C) a hydrosilylation reaction catalyst in an amount sufficient to initiate curing of the composition (A) and (B);
- (D) a thermally conductive filler, wherein the thermally conductive filler is selected from aluminum nitride, aluminum oxide, aluminum trihydrate, barium titanate, beryllium oxide, boron nitride, carbon fibers, diamond, graphite, magnesium hydroxide, magnesium oxide, metal particulate, onyx, silicon carbide, tungsten carbide, zinc oxide, and a combination thereof, and wherein the thermally conductive filler is in an amount ranging from 50% to 97% by volume of the composition;
- and
- (E) an additive selected from the group consisting of metal-free and metal-containing phthalocyanine compounds, wherein the amount of the additive is from 0.01 to 0.2 weight % of the composition.
A method of increasing the stability of a thermally conductive organopolysiloxane composition comprising the step of adding a phthalocyanine compound ranging from 0.01 to 0.2 weight % of the whole composition and thermally conductive filler ranging from 50% to 97% by volume of the whole composition to the curable organopolysiloxane composition, wherein molar ratio of SiH:Vi of the curable organopolysiloxane composition is from 3:1 to 0.1:1.
Dependencies are inferred from the claim text.