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US 9,596,762 B2Granted
Method of fabricating a circuit board
AssigneeSnu R&Db Foundation
InventorsSeung Hun Hong, Min Baek Lee
Life of this patent
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Abstract
Example methods of fabricating a circuit board are disclosed. An example method includes providing a substrate, forming at least one or more channels having linear nanostructures on the substrate, and forming a first electrode and a second electrode on the substrate, where the at least one or more channels electrically couple the first electrode to the second electrode.
Claims16
A method of fabricating a circuit board, the method comprising:
- providing a substrate;
- forming a plurality of channels including linear nanostructures on the substrate;
- and
- forming a first electrode and a second electrode on the substrate and allowing the plurality of channels to electrically couple the first electrode to the second electrode,
- wherein the forming of the plurality of channels including the linear nanostructures on the substrate comprises:
- forming a nonpolar molecular layer pattern on the substrate;
- and
- forming the plurality of channels by self-assembling the linear nanostructures on an exposed region of the substrate that is not covered by the nonpolar molecular layer pattern,
- wherein forming of the plurality of channels by self-assembling the linear nanostructures on the exposed region of the substrate that is not covered by the nonpolar molecular layer pattern comprises immersing the substrate in a solution including the linear nanostructures.
6 more elements
A method of fabricating a circuit board, the method comprising:
- providing a patterned substrate comprising one or more linear regions extending in a first direction, wherein the one or more linear regions comprise a polar molecular layer or exposed regions of the patterned substrate;
- applying linear nanostructures to the one or more linear regions to form one or more channels on the one or more linear regions, wherein the one or more channels comprise the linear nanostructures and the one or more channels extend in the first direction;
- and
- disposing a first electrode and a second electrode on the patterned substrate, wherein the first electrode and the second electrode are configured to be electrically coupled by the one or more channels,
- wherein the one or more channels are formed on the one or more linear regions by self-assembling the linear nanostructures in the one or more linear regions by immersing the patterned substrate in a solution including the linear nanostructures.
2 more elements
A method of fabricating a circuit board, the method comprising:
- providing a substrate;
- forming a plurality of channels including linear nanostructures on the substrate;
- and
- forming a first electrode and a second electrode on the substrate and allowing the plurality of channels to electrically couple the first electrode to the second electrode,
- wherein the forming of the plurality of channels including the linear nanostructures on the substrate comprises:
- forming a polar molecular layer pattern and a nonpolar molecular layer pattern on the substrate;
- and
- forming the plurality of channels by self-assembling the linear nanostructures in the polar molecular layer pattern, and wherein forming of the plurality of channels by self-assembling the linear nanostructures in the polar molecular layer pattern comprises immersing the substrate in a solution including the linear nanostructures.
5 more elements
Dependencies are inferred from the claim text.