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US 9,578,771 B2Granted
Backplane module and method of manufacturing same
AssigneeLabinal
InventorsPatrick Wellington Mills, James Michael McCormick, David Michael Geier
Life of this patent
Estimating the term…
Abstract
A method of manufacturing a backplane module includes providing a thermally conductive substrate, and applying a predetermined volume of epoxy extending between a first electrical component disposed on the thermally conductive substrate and a second electrical component disposed on the thermally conductive substrate to create an electrical pathway therebetween.
Claims18
A method of manufacturing a backplane module comprising:
- providing a thermally conductive substrate, and
- applying a predetermined volume of epoxy extending between a first electrical component disposed on said thermally conductive substrate and a second electrical component disposed on said thermally conductive substrate to create an electrical pathway therebetween, wherein said first electrical component is a load connector, and wherein said predetermined volume of epoxy mechanically couples said load connector to said thermally conductive substrate.
A backplane module comprising:
- a thermally conductive substrate;
- a plurality of electrical components disposed on said thermally conductive substrate;
- and
- at least one predetermined volume of epoxy extending between at least a first one of said electrical components and at least a corresponding second one of said electrical components, thereby creating an electrical pathway therebetween, wherein said first one of said electrical components is a load connector, and wherein said predetermined volume of epoxy mechanically couples said load connector to said thermally conductive substrate.
1 more element
A backplane module comprising:
- a thermally conductive substrate;
- a plurality of electrical components disposed on said thermally conductive substrate;
- and
- at least one predetermined volume of epoxy extending between at least a first one of said electrical components and at least a corresponding second one of said electrical components, thereby creating an electrical pathway therebetween, the backplane module in combination with an electrical system, the electrical system comprising a number of electrical apparatus being electrically connected to a corresponding one of said electrical components of said backplane module, the backplane module further comprising:
- an insulator overlying the thermally conductive substrate, said at least one predetermined volume of epoxy being disposed between said insulator and said thermally conductive substrate;
- and
- a cap layer overlying the insulator,
- wherein the thermally conductive substrate has a plurality of through holes, each of the plurality of electrical components extending through a corresponding one of the plurality of through holes,
- wherein said at least one predetermined volume of epoxy mechanically couples at least one of said plurality of electrical components to said thermally conductive substrate,
- wherein said number of electrical apparatus includes at least one circuit breaker, and
- wherein said at least one circuit breaker engages said first one of said electrical components.
8 more elements
Dependencies are inferred from the claim text.