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US 9,578,760 B2Granted
Circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same
AssigneeSamsung Electronics Co., Ltd.
InventorsHyojae Bang, Dogeun Kim, Hongkyun Kim, Youngbok Jeon
Life of this patent
Estimating the term…
Abstract
Example embodiments are directed to circuit boards, connectors, cases, circuit board assemblies, case assemblies, devices and methods of manufacturing the same, which are common to at least two different form factors. In an example embodiment, the SSD includes a circuit board that is smaller than a case, and the circuit board is secured to the bottom surface of the case by the securing element. The securing element is spaced apart from edges of the case to allow using a circuit board that is smaller than the case.
Claims30
A solid state drive (SSD) comprising:
- a case including a bottom surface having a first edge, a second edge, a third edge and a fourth edge, the second edge of the bottom surface of the case being located opposite to the first edge of the bottom surface of the case;
- a plurality of circuit board connection terminals along the first edge of the case;
- at least one securing element disposed on the bottom surface of the case of the SSD;
- a circuit board secured to the bottom surface of the case by the at least one securing element, the circuit board including a first surface having a first edge;
- a plurality of connector connection terminals disposed along the first edge of the first surface of the circuit board, the first edge of the first surface of the circuit board being disposed closer to the first edge of the bottom surface of the case than to the second edge of the bottom surface of the case;
- a first flash memory package disposed on the first surface of the circuit board, and having a width and a length that is equal to or greater than the width, the length being substantially perpendicular to the width, each of the length and the width being measured on a top surface of the first flash memory package, the top surface of the first flash memory package being substantially parallel with the first surface of the circuit board;
- and
- a memory controller package disposed on the first surface of the circuit board,
- wherein a first distance is greater than the width of the first flash memory package, the first distance being a shortest distance between the circuit board and the second edge of the bottom surface of the case,
- the plurality of connector connection terminals are connected to the plurality of circuit board connection terminals at the first surface of the circuit board via a conductor,
- the at least one securing element is substantially spaced apart from each of the first edge, the second edge, the third edge and the fourth edge of the bottom surface of the case,
- the at least one securing element includes structures that form a frame for engaging at least two sides of the circuit board to receive the circuit board by non-sliding motion into the case, and
- the circuit board is secured to the bottom surface of the case.
10 more elements
A solid state drive (SSD) comprising:
- a case including a bottom surface having a first edge, a second edge, a third edge and a fourth edge, the second edge of the bottom surface of the case being located opposite to the first edge of the bottom surface of the case;
- a plurality of circuit board connection terminals along the first edge of the case;
- at least one securing element disposed on the bottom surface of the case of the SSD;
- a circuit board secured to the bottom surface of the case by the at least one securing element, the circuit board including a first surface and a second surface, the second surface being opposite to the first surface, the first surface having a first edge;
- a plurality of connector connection terminals disposed along the first edge of the first surface of the circuit board, the first edge of the first surface of the circuit board being disposed closer to the first edge of the bottom surface of the case than to the second edge of the bottom surface of the case;
- a memory controller package disposed on the first surface of the circuit board, and having a width and a length that is equal to or greater than the width, the length being substantially perpendicular to the width, each of the length and the width being measured on a top surface of the memory controller package, the top surface of the memory controller package being substantially parallel with the first surface of the circuit board;
- and
- a first flash memory package disposed on the second surface of the circuit board,
- wherein a first distance is greater than the width of the memory controller package, the first distance being a shortest distance between the circuit board and the second edge of the bottom surface of the case,
- the plurality of connector connection terminals are connected to the plurality of circuit board connection terminals at the first surface of the circuit board via a conductor,
- the at least one securing element is substantially spaced apart from each of the first edge, the second edge, the third edge and the fourth edge of the bottom surface of the case, and the at least one securing element forms a frame for engaging at least two sides of the circuit board to receive the circuit board by non-sliding motion into the case, and
- the circuit board is secured to the bottom surface of the case.
9 more elements
A solid state drive (SSD) comprising:
- a case including a bottom surface having a first edge, a second edge, a third edge and a fourth edge, the second edge of the bottom surface of the case being located opposite to the first edge of the bottom surface of the case;
- a plurality of circuit board connection terminals along the first edge of the case;
- a circuit board secured to the case of the SSD;
- a plurality of connector connection terminals disposed along a first edge of a first surface of the circuit board, the first edge of the first surface of the circuit board being disposed closer to the first edge of the bottom surface of the case than to the second edge of the bottom surface of the case;
- a first package disposed on the first surface of the circuit board, the first package having a width and a length that is equal to or greater than the width, the length being substantially perpendicular to the width, each of the length and the width being measured on a first surface of the first package, the first surface of the first package being substantially parallel with the first surface of the circuit board;
- and
- at least one securing element disposed on the bottom surface of the case, wherein
- the circuit board is secured to the case of the SSD by the at least one securing element,
- at least one of a memory and a memory controller is included inside the first package,
- a first distance is greater than the width of the first package, the first distance being a shortest distance between the circuit board and the second edge of the bottom surface of the case,
- the plurality of connector connection terminals are connected to the plurality of circuit board connection terminals at the first surface of the circuit board via a conductor,
- the circuit board is spaced apart from the second, third and fourth edges of the bottom surface of the case,
- the at least one securing element is substantially spaced apart from each of the first edge, the second edge, the third edge, and the fourth edge of the bottom surface of the case,
- the at least one securing element forms a frame for engaging at least two sides of the circuit board to receive the circuit board by non-sliding motion into the case, and
- the circuit board is secured to the bottom surface of the case.
12 more elements
Dependencies are inferred from the claim text.