Method for producing a hermetic housing for an electronic device
Assigneemb-microtec ag
InventorsHeinz Blunier, Hannes Kind, Sandro M. O. L. Schneider
Life of this patent
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Abstract
A method produces a housing with at least one hermetically sealed receiving space for an electronic component, the receiving space including at least a part of the interior of the housing. In the method, a hollow body made of glass and having at least one opening is produced/provided, at least one electronic device is introduced through the at least one opening, and the receiving space is hermetically sealed by melting the housing, or the at least one opening is sealed by laser radiation. A device has an at least partially hermetically sealed housing made of silicon, particularly a housing produced according to the above-mentioned method.
Claims39
Method for the production of a housing having at least one hermetically sealed accommodation space for an electronic device, said accommodation space comprising at least a part of an interior of the housing, comprising the steps:
- producing/making available a hollow body made of glass or silicon, having at least one opening,
- introducing, positioning and/or fixing in place at least one electronic device through the at least one opening, and
- closing off and welding the at least one opening by means of laser radiation, and
- wherein the laser radiation is formed by means of nanosecond and/or picosecond pulses.
Apparatus according to 31, wherein a wall thickness of the housing, at least in the center region, amounts to between 0.05 mm to 5 mm.
Dependencies are inferred from the claim text.