Printed circuit board backup plate and the preparation method thereof

A method for preparing a printed circuit board backing plate, comprising:

• coating a lubricating and radiating resin on the upper and lower surfaces of a wood fiberboard to form a lubricating and radiating resin layer;
• before the lubricating and radiating resin is completely dried out, bonding a wood pulp paper to the exposed surfaces of the lubricating and radiating resin layer;
• and
• coating the outer surface of the wood pulp paper with unsaturated polyester resin to form an unsaturated polyester resin layer;
• wherein the lubricating and radiating resin is prepared from a principal component of 95 parts by weight and a nonionic surfactant of 5 parts by weight, the principal component, in parts by weight, is composed of:
• polyethylene oxide 10-30, polyethylene glycol 10-30, glycerol 3-8, vinyl acetate 30-60.

A method for preparing a printed circuit board backing plate, comprising:

• coating a lubricating and radiating resin on the upper and lower surfaces of a wood fiberboard to form a lubricating and radiating resin layer;
• before the lubricating and radiating resin is completely dried out, bonding a wood pulp paper to the exposed surfaces of the lubricating and radiating resin layer;
• and
• coating the outer surface of the wood pulp paper with unsaturated polyester resin to form an unsaturated polyester resin layer;
• wherein the lubricating and radiating resin is prepared from a principal component of 95 parts by weight and a nonionic surfactant of 5 parts by weight, the principal component, in parts by weight, is composed of:
• polyethylene oxide 10-25, polyethylene glycol 10-25, glycerol 2-6, polyvinyl alcohol 40-60.