Cutting method of flat wire, and cutting tool
AssigneeToyota Jidosha Kabushiki Kaisha
InventorHideki Manabe
Life of this patent
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Abstract
A cutting method of the invention cuts a flat wire covered with a film, using a pair of first blades, and a second blade that is arranged between the pair of first blades. This cutting method includes a step of forming tapered cuts in an upper surface of the flat wire, by the pair of first blades cutting part way into the flat wire in a thickness direction, from the upper surface of the flat wire, and a step of cutting the flat wire by the second blade, between the two cuts, so as to form a chamfer on both side surfaces next to the upper surface of the flat wire.
Claims4
A cutting method for cutting a flat wire covered with a film, using a pair of first blades, and a second blade that is arranged between the pair of first blades, comprising:
- a step of forming tapered cuts in an upper surface of the flat wire, by the pair of first blades cutting part way into the flat wire in a thickness direction, from the upper surface of the flat wire;
- and
- a step of cutting the flat wire by the second blade, between the two cuts, so as to form a chamfer on both side surfaces next to the upper surface of the flat wire.
A cutting tool that cuts a flat wire, comprising:
- a pair of first blades;
- and
- a second blade arranged between the pair of first blades,
- wherein a tapered surface that becomes thinner toward a tip end side is formed on a tip end portion of each of the two first blades;
- the tapered surfaces of the pair of first blades are arranged so as to come closer to each other farther toward the tip end side;
- and
- an inclined surface to provide a chamfer on both side surfaces of the flat wire is formed on the second blade.
Dependencies are inferred from the claim text.