Thermal stabilization of temperature sensitive components

An electronic assembly, comprising:

• a printed circuit board having a first side and an opposing second side;
• at least one temperature sensitive component mounted on the first side of the printed circuit board;
• an enclosure coupled to a portion of the printed circuit board where the at least one temperature sensitive component is mounted, the enclosure comprising:
• a first cover section mounted over a portion of the first side of the printed circuit board, the first cover section including a first lid and at least two sidewalls that extend from a perimeter of the first lid, the first cover section defining a cavity that contains the at least one temperature sensitive component, wherein the at least two sidewalls have a first set of flexible pads that each include tapered flanges that are engaged with the second side of the printed circuit board;
• and
• a second cover section mounted over a portion of the second side of the printed circuit board opposite from the first cover section, the second cover section including a second lid and at least one sidewall that extends from a perimeter of the second lid;
• and
• a heater mounted on the first side or the second side of the printed circuit board and located within the enclosure, the heater separate from the temperature sensitive component;
• wherein the first and second cover sections are releasably connected with the printed circuit board, and the enclosure is configured to thermally stabilize the at least one temperature sensitive component;
• wherein the first and second cover sections include the same structural features such that the first and second cover sections are mountable interchangeably over either the first side or the second side of the printed circuit board.